Patents Assigned to Pukyong National University Business Incubator Center
  • Patent number: 9579747
    Abstract: A shear bonding device and a shear bonding method of metal plates are disclosed.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: February 28, 2017
    Assignees: SUNGWOO HITECH CO., LTD., PUKYONG NATIONAL UNIVERSITY BUSINESS INCUBATOR CENTER
    Inventor: In Tai Jin
  • Publication number: 20150202711
    Abstract: A device of vibro-spot welding may include: a vibration cylinder housing formed of first and second piston chambers divided by a dividing wall; a first piston rod being an annular rod, integrally connected with a first piston disposed in the first piston chamber, and having one end penetrating a side of the vibration cylinder housing; a second piston rod being a circular rod penetrating the annular rod, integrally connected to a second piston disposed in the second piston chamber, and having one end penetrating the side of the vibration cylinder housing; a leading-in housing wrapping an exterior surface of the vibration cylinder housing and receiving current from a power source; an electrode supporter threaded with one end of the leading-in housing; a heating electrode threaded with one end of the electrode supporter; a first vibration electrode threaded with the one end of the first piston rod and penetrating the electrode supporter and the heating electrode; and a second vibration electrode threaded with th
    Type: Application
    Filed: April 11, 2014
    Publication date: July 23, 2015
    Applicants: SUNGWOO HITECH CO., LTD., PUKYONG NATIONAL UNIVERSITY BUSINESS INCUBATOR CENTER
    Inventor: In Tai JIN
  • Patent number: 8283601
    Abstract: A bonding apparatus of metal plates includes an upper mold having a first guide pathway formed vertically inside thereof; a middle mold having a second guide pathway formed vertically inside thereof, where the middle mold is disposed under the upper mold; a lower mold having a metal removing pathway formed vertically inside thereof, where the lower mold is disposed under the middle mold; a heating unit for heating the metal plates and a metal tape; a punch for applying a bonding load to the metal plates; a clamping unit that applies a clamping load for clamping the metal plates to the upper mold; and a bonding unit that applies the bonding load to the punch for bonding the metal plates.
    Type: Grant
    Filed: July 14, 2006
    Date of Patent: October 9, 2012
    Assignees: Sungwoo Hitech Co., Ltd., Pukyong National University Business Incubator Center
    Inventor: In Tai Jin