Abstract: An integrated circuit is provided having super imposed metal strip conductor portions separated by dielectric layers, the conductor portions being provided with upper and lower films of a material having a higher melting temperature than that of the conductor material, the integrated circuit having connections linking predetermined superimposed conductor portions through the dielectric layers, the connections being made by joining beads formed in a laser beam programmed opening. A method for establishing a connection of this type is also provided which includes applying a laser beam to make an opening through an insulating layer, the upper conductor, the dielectric layer, and a portion of the lower conductor, and forming a connection in the opening by selectively controlling the power, the diameter, the number and duration of pulses of the laser beam such that beads are formed beginning at the two conductors which unite to form the connection.