Abstract: Methods and apparatus for providing enhanced coupled inductive devices. In one embodiment, an inductive device is disclosed that is suitable in Ethernet applications with data speeds exceeding one (1) Gbps. Specifically, the inductive devices described herein possess a high level of magnetic and capacitive coupling between the wires of the windings. Moreover, the inductive devices described herein are suitable for automated processes, thereby reducing the overall costs associated with their manufacture and use. Furthermore, methods for manufacturing and using these aforementioned inductive devices are also disclosed. For example, the aforementioned inductive devices may readily be incorporated into ICMs thereby replacing, in their entirety or in part, manually wound toroidal transformers.

Abstract: Network transformer structures including a production method therefore are disclosed. In one embodiment, multiple integrated I-shaped magnetic cores that include three winding barrel portions based on a new design for a magnetic core structure is disclosed. A first winding barrel portion and a second winding barrel portion are configured to wind a transformer winding, and a third winding barrel portion is configured to wind a common mode choke winding, so that a transformer and a common mode choke are combined onto one magnetic core to replace two previous magnetic cores, thereby saving on the overall network transformer structure cost as well as space on, for example, an end consumer printed circuit board.

Abstract: Methods and apparatus for providing enhanced coupled inductive devices. In one embodiment, an inductive device is disclosed that is suitable in Ethernet applications with data speeds exceeding one (1) Gbps. Specifically, the inductive devices described herein possess a high level of magnetic and capacitive coupling between the wires of the windings. Moreover, the inductive devices described herein are suitable for automated processes, thereby reducing the overall costs associated with their manufacture and use. Furthermore, methods for manufacturing and using these aforementioned inductive devices are also disclosed. For example, the aforementioned inductive devices may readily be incorporated into ICMs thereby replacing, in their entirety or in part, manually wound toroidal transformers.

Abstract: An integrated connector module (ICM) is disclosed. In one embodiment, the ICM includes a plurality of shielding components, the plurality of shielding components comprising a port to port shield, an insert to insert shield and a main body shield. The ICM also contains one or more housing components, the one or more housing components comprising a plurality of ports that are arranged so as to be offset from a main signal conditioning portion of the one or more housing components; and an electronics assembly disposed within the one or more housing components. Methods and apparatus for utilizing and manufacturing the aforementioned ICM are also disclosed.

Abstract: A low profile, small size and high performance electronic device for use in, e.g., electronic circuits which provides maximum creepage and/or clearance distances. In one embodiment, the device is configured for a small footprint and utilizes two or more windings that require isolation. The exemplary device includes a self-leaded header made from a unitary construction which comprises a generally a box-like support body having a cavity for mounting a circuit element with primary and secondary windings, the support body having a base and a plurality of leads extending generally horizontally outward from the support body adjacent the base, the support body having one side opening on a side with leads permitting the loading of the inductive device in the cavity, and a routing channel residing on the top of the base, so as to maximize the creepage and clearance distance of the electronic device. Shaped-core and other embodiments are also disclosed.

Abstract: An arc fault sensor disposed on a circuit board proximate to a current carrying trace. The arc fault sensor includes a magnetic flux concentrator (MFC). The MFC includes a first flange and a second flange that are joined by a center post. Each of the first and second flanges have a cross sectional area that is larger than the center post. A sense coil winding is wound around the center post. The arc fault sensor generates an output voltage that is proportional to a rate of change of current in the current carrying conductor. For a given diameter of the sense coil winding, the output voltage is enhanced by the ratio of the cross-sectional areas of the flanges relative to the cross-sectional area of the center post. Methods of manufacturing and utilizing the aforementioned arc fault sensor are also disclosed.

Abstract: A low cost, low profile, small size and high performance inductive device for use in electronic circuits. In one exemplary embodiment, the device includes a ferrite core comprising a step gap, a winding disposed on the core, and a magnetic powder and epoxy mixture packed in to create a cubic-shaped inductor optimized for electrical and magnetic performance. Additionally, the incorporation of the magnetic powder and epoxy mixture around the step gap eliminates fringing magnetic fields during device operation thereby minimizing adverse electromagnetic inference on adjacently disposed electronic components. The geometry and placement of the step gaps can be varied in order to optimize performance parameters associated with the underlying inductive device. Methods of manufacture and use for the inductive device are also disclosed.

Abstract: A low profile, small size and high performance electronic device for use in, e.g., electronic circuits which provides maximum creepage and/or clearance distances. In one embodiment, the device is configured for a small footprint and utilizes two or more windings that require isolation. The exemplary device includes a self-leaded header made from a unitary construction which comprises a generally a box-like support body having a cavity for mounting a circuit element with primary and secondary windings, the support body having a base and a plurality of leads extending generally horizontally outward from the support body adjacent the base, the support body having one side opening on a side with leads permitting the loading of the inductive device in the cavity, and a routing channel residing on the top of the base, so as to maximize the creepage and clearance distance of the electronic device. Shaped-core and other embodiments are also disclosed.

Abstract: A low-cost and high-precision current sensing device and methods for use and manufacturing. In one embodiment, the current sensing apparatus comprises a Rogowski-type coil which is manufactured in segments so as to facilitate the manufacturing process. In an exemplary embodiment, the current sensing apparatus segments are asymmetric in shape and/or composition (e.g., bobbin shape, size, and/or winding configuration) so as to account for asymmetries in the magnetic field distribution around a bus bar, or to accommodate its shape in a more compact form factor, and/or to improve the immunity to the effects of an external magnetic field. Methods of manufacturing and using the aforementioned current sensing apparatus are also disclosed.

Abstract: A low-cost and high-precision current sensing device and methods for use and manufacturing. In one embodiment, the current sensing apparatus comprises a Rogowski-type coil which is manufactured in segments so as to facilitate the manufacturing process. In an exemplary embodiment, the current sensing apparatus segments comprise a number of bobbin elements that are wound and subsequently formed into complex geometric shapes such as torus-like shapes. In an alternative embodiment, bonded windings are utilized which allow the segments to be formed without a bobbin or former. In yet another alternative embodiment, the aforementioned current sensing devices are stacked in groups of two or more. Methods of manufacturing and using the aforementioned current sensing apparatus are also disclosed.

Abstract: Space- and cost-efficient antenna apparatus and methods of making and using the same. In one embodiment, the antenna is formed using a deposition process, whereby a conductive fluid or other material is deposited directly on one or more interior components of a host device (e.g., cellular phone or tablet computer). The antenna can be formed in a substantially three-dimensional “loop” shape, and obviates several costly and environmentally unfriendly processing steps and materials associated with prior art antenna manufacturing approaches.

Abstract: Low passive intermodulation (PIM) antenna assemblies and methods for utilizing the same. In one embodiment, the low PIM antenna assembly includes an ultra-wide band quarter wave monopole over ground plane antenna apparatus that operates within a band from 698-5900 MHz. The radiating element is comprised of three (3) features that are separated from one another by one hundred twenty (120°) thus producing a triangular shaped pattern. Such a configuration reduces the nulls by about twenty percent (20%) as compared with similar antenna implementations having flat radiating elements. Moreover, in order to reduce the diameter of the ground plane while simultaneously increasing the electrical length of the ground plane, forming of the ground plane is required. Methods of using the aforementioned low PIM antenna assembly are also disclosed.

Abstract: An exemplary connector insert assembly, and methods of manufacture and use thereof. In one embodiment, the connector insert assembly comprises an insert body assembly consisting of two insert body elements made from a high-temperature polymer. The insert body assembly includes an electronic component receiving cavity that is configured to receive any number of electronic components, including without limitation, chip chokes and wire wound electronic components. The insert body assembly includes a wire termination feature that includes termination slots that position the wire ends of the wire wound electronic components adjacent to a substrate to which the wire ends are ultimately to be secured. The wire ends are then secured to the substrate using, for example, a mass termination technique. The aforementioned connector insert assembly can then be inserted into a single or multi-port connector assembly. Methods of manufacturing the aforementioned single or multi-port connector assemblies are also disclosed.

Abstract: A low-cost and high-precision current sensing device and methods for use and manufacturing. In one embodiment, the current sensing apparatus comprises a Rogowski-type coil which is manufactured in segments so as to facilitate the manufacturing process. In an exemplary embodiment, the current sensing apparatus segments comprise a number of bobbin elements that are wound and subsequently formed into complex geometric shapes such as torus-like shapes. In an alternative embodiment, bonded windings are utilized which allow the segments to be formed without a bobbin or former. In yet another alternative embodiment, the aforementioned current sensing devices are stacked in groups of two or more. Methods of manufacturing and using the aforementioned current sensing apparatus are also disclosed.

Abstract: A low profile and small size electronic device for use in, e.g., electronic circuits which provides maximum creepage and/or clearance distances. In one embodiment, the device is configured for a small footprint and utilizes two or more windings that require isolation. The exemplary device includes a self-leaded header made from a unitary construction which comprises a box-like support body having a cavity for mounting a circuit element, the support body having a base and leads extending generally horizontally outward from the support body adjacent the base, the support body having one side opening on a side with leads permitting the loading of the inductive device in the cavity, and a routing channel residing on the top of the base, so as to maximize the creepage and clearance distance of the electronic device. Shaped-core and other embodiments are also disclosed.

Abstract: An exemplary connector insert assembly, and methods of manufacture and use thereof. In one embodiment, the connector insert assembly comprises an insert body assembly consisting of two insert body elements made from a high-temperature polymer. The insert body assembly includes an electronic component receiving cavity that is configured to receive any number of electronic components, including without limitation, chip chokes and wire wound electronic components. The insert body assembly includes a wire termination feature that includes termination slots that position the wire ends of the wire wound electronic components adjacent to a substrate to which the wire ends are ultimately to be secured. The wire ends are then secured to the substrate using, for example, a mass termination technique. The aforementioned connector insert assembly can then be inserted into a single or multi-port connector assembly. Methods of manufacturing the aforementioned single or multi-port connector assemblies are also disclosed.

Abstract: Space- and cost-efficient antenna apparatus and methods of making and using the same. Antenna may comprise one or more planar radiator elements fabricated from an electrically conductive material. Surface area of the antenna radiator metallized portion may be reduced by utilizing a crosshatch pattern. The pattern may comprise of one or more metal-free elements disposed within the outline of the radiator. The elements may be interconnected by conductive crosslinks. The antenna may be coupled to radio electronics at one or more connection points. At least one of a size and/or a placement of the crosslinks may be configured based on distance from the connecting points. Crosslink size and/or placement may be configured to provide a prescribed current flow within the antenna. Reducing surface area of the antenna radiator may reduce manufacturing time and/or cost compared with prior art antenna design approaches.

Abstract: An exemplary header insert assembly, and methods of manufacture and use thereof. In one embodiment, the header insert assembly comprises a connector insert assembly having an insert body assembly consisting of an insert body element. The insert body element includes an electronic component receiving cavity that is configured to receive any number of electronic components. The insert body assembly also includes a wire termination feature that includes termination slots that position the wire ends of the wire wound electronic components adjacent to a substrate to which the wire ends are ultimately to be secured. The wire ends are then secured to the substrate using, for example, a mass termination technique. The aforementioned header insert assembly can then be optionally inserted into a single or multi-port connector assembly. Methods of manufacturing the aforementioned single or multi-port connector assemblies are also disclosed.

Abstract: A low cost, reduced form factor, high performance electronic device for use in electronic circuits and methods. In one exemplary embodiment, the device includes a unitary header assembly construction that ensures device coplanarity and also includes vertically oriented terminal pins. The device utilizes preconfigured flat coil windings that are disposed directly within a planar core. The flat coil windings further include features that are configured to mate with the header assembly terminal pins which substantially simplify the manufacturing process. Methods for manufacturing the device are also disclosed.