Patents Assigned to Pulse MEMS ApS
  • Patent number: 8188557
    Abstract: The invention relates to an acoustic micro-electrical-mechanical-system (MEMS) transducer formed on a single die based on a semiconductor material and having front and back surface parts opposed to each other. The invention further relates to a method of manufacturing such an acoustic MEMS transducer. The acoustic MEMS transducer comprises a cavity formed in the die to thereby provide a back volume with an upper portion facing an opening of the cavity and a lower portion facing a bottom of the cavity. A back plate and a diaphragm are arranged substantially parallel with an air gap there between and extending at least partly across the opening of the cavity, with the back plate and diaphragm being integrally formed with the front surface part of the die. The bottom of the cavity is bounded by the die. The diaphragm may be arranged above the back plate and at least partly extending across the back plate.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: May 29, 2012
    Assignee: Pulse MEMS Aps.
    Inventors: Pirmin Rombach, Morten Berg Arnoldus, Morten Ginnerup
  • Publication number: 20100142744
    Abstract: A portable communication device assembly comprising a housing and a PCB provided therein. A microphone is provided at least partly within an aperture in the PCB, which aperture is positioned adjacent to a sound input of the housing. The microphone may be attached to a carrier element also attached to the PCB, and additional electronic components may be attached to the carrier element. Acoustic and/or electromagnetic shielding may be provided.
    Type: Application
    Filed: November 22, 2007
    Publication date: June 10, 2010
    Applicant: PULSE MEMS APS.
    Inventors: Pirmin Herman Otto Rombach, Jorg Rehder
  • Publication number: 20090214061
    Abstract: The present invention relates to a miniature microphone assembly comprising a capacitive microphone transducer comprising a microphone electrical contact or terminal, a microphone carrier comprising a carrier electrical contact or terminal formed on a first surface thereof, and an integrated circuit die comprising a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a first electrically conductive path surrounding the carrier electrical contact or terminal.
    Type: Application
    Filed: February 19, 2009
    Publication date: August 27, 2009
    Applicant: Pulse MEMS ApS.
    Inventors: Leif Steen Johansen, Per F. Høvesten, Gino Rocca
  • Publication number: 20090169035
    Abstract: The invention relates to an acoustic micro-electrical-mechanical-system (MEMS) transducer formed on a single die based on a semiconductor material and having front and back surface parts opposed to each other. The invention further relates to a method of manufacturing such an acoustic MEMS transducer. The acoustic MEMS transducer comprises a cavity formed in the die to thereby provide a back volume with an upper portion facing an opening of the cavity and a lower portion facing a bottom of the cavity. A back plate and a diaphragm are arranged substantially parallel with an air gap there between and extending at least partly across the opening of the cavity, with the back plate and diaphragm being integrally formed with the front surface part of the die. The bottom of the cavity is bounded by the die. The diaphragm may be arranged above the back plate and at least partly extending across the back plate.
    Type: Application
    Filed: March 29, 2007
    Publication date: July 2, 2009
    Applicant: Pulse MEMs Aps
    Inventors: Pirmin Rombach, Morten Berg Arnoldus, Morten Ginnerup
  • Patent number: 7447323
    Abstract: The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: November 4, 2008
    Assignee: Pulse MEMS ApS
    Inventors: Matthias Mullenborn, Jochen F. Kuhmann, Peter Scheel
  • Patent number: RE40781
    Abstract: A method of providing at least part of a diaphragm and at least a part of a back-plate of a condenser microphone with a hydrophobic layer so as to avoid stiction between said diaphragm and said back-plate. The layer is deposited via a number small of openings in the back-plate, the diaphragm and/or between the diaphragm and the back-plate. Provides a homogeneous and structured hydrophobic layer, even to small internal cavities of the microstructure. The layer may be deposited by a liquid phase or a vapor phase deposition method. The method may be applied naturally in continuation of the normal manufacturing process. Further, a MEMS condenser microphone is provided having such a hydrophobic layer. The static distance between the diaphragm and the back-plate of the microphone is smaller than 10 ?m.
    Type: Grant
    Filed: August 10, 2006
    Date of Patent: June 23, 2009
    Assignee: Pulse MEMS ApS
    Inventors: Ib Johannsen, Niels Bent Larsen, Matthias Mullenborn, Pirmin Hermann Otto Rombach