Abstract: A method for curing thermosetting polymers is disclosed. A thermosetting polymer precursor is deposited on a substrate. After the thermosetting polymer precursor has been preheated, the thermosetting polymer precursor is then exposed to a light pulse from a flashlamp while it is being cooled simultaneously in order to maintain an average temperature of the thermosetting polymer precursor at below its maximum working temperature. After the thermosetting polymer precursor has been exposed to the light pulse, a by-product is allowed to dissipate from the thermosetting polymer precursor. The light pulse exposure step and the by-product dissipation step are repeated multiple times until a thermosetting polymer thin film is formed.

Abstract: A method for curing thermosetting polymers on a glass substrate is disclosed. A light-absorbing layer is deposited on a glass substrate, and a thermosetting polymer precursor is then deposited on the light-absorbing layer in liquid form. After the thermosetting polymer precursor has been preheated, the thermosetting polymer precursor is then exposed to a light pulse from a flashlamp while it is being cooled simultaneously in order to maintain an average temperature of the thermosetting polymer precursor at below its maximum working temperature. After the thermosetting polymer precursor has been exposed to the light pulse, a gaseous by-product is allowed to dissipate from the thermosetting polymer precursor. The light pulse exposure step and the by-product dissipation step are repeated multiple times until a thermosetting polymer thin film is formed. Afterwards, the thermosetting polymer film is released from the light-absorbing layer.

Abstract: An apparatus for debonding a wafer from a bonded wafer stack is disclosed. The apparatus includes a flashlamp, a flashlamp control unit, and a wafer debonding unit. A processed wafer can be debonded from a bonded wafer stack by applying light pulses from the flashlamp. The flashlamp is controlled by the flashlamp control unit that includes a capacitor bank, a power supply for charging the capacitor bank, an IGBT-based switching device, and a frequency controller. The wafer debonding unit includes a debonding vacuum table, a wafer feeding robot for conveying the bonded wafer stack to the debonding vacuum table, a set of suction cups for applying vacuum to the bonded wafer stack when light pulses are being emitted by the flashlamp to debond the processed wafer from the bonded wafer stack.

Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an air stream is utilized to carry the particles off the surface of the wafer.

Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A liquid is placed on a surface of a semiconductor wafer on which particles may adhere. A light pulse is then applied to the surface of the semiconductor wafer through the liquid. The liquid containing the particles is then removed from the surface of the semiconductor wafer.

Abstract: A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.

Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an electric grid is utilized to remove the particles off the surface of the wafer.

Abstract: A method for attaching and detaching a substrate from a bonded stack is disclosed. A broadband light-absorbing material is combined with an adhesive material to form a broadband light-absorbing adhesive. A layer of the broadband light-absorbing adhesive is then applied on one side of a transparent carrier. A substrate is placed on the broadband light-absorbing adhesive and the transparent carrier to form a bonded stack. The substrate can be a wafer or a polymeric film. At this point, processing steps can be performed on the substrate. After the processing steps have been completed, a light pulse from a flashlamp is utilized to heat up the broadband light-absorbing adhesive in order to loosen the substrate from the bonded stack such that the substrate can be easily detached from the bonded stack.