Abstract: A multi-modal diamond abrasive package or slurry is disclosed for polishing hard substrates. The multi-modal diamond abrasive package or slurry generally includes a plurality of diamond abrasives. Each one of the diamond abrasives of the plurality of diamond abrasives has a particle size. Wherein, the multi-modal diamond abrasive package or slurry includes a first diamond abrasive and a second diamond abrasive. The first diamond abrasive has a first particle size, and the second diamond abrasive has a second particle size. Where, the first particle size of the first diamond abrasive is smaller than the second particle size of the second diamond abrasive.
Type:
Grant
Filed:
January 30, 2020
Date of Patent:
January 18, 2022
Assignee:
PUREON INC.
Inventors:
Terry Michael Knight, William Rollins Gemmill, Keith Harris Joye, Tony Russell Martin