Abstract: A plurality of fans for use in a fan module that is configured to allow tool-free assembly and disassembly, at least one of the fans includes either a first connector and a second connector, two first connectors, or two second connectors, where the first connector and the second connector are complementary. The first connector includes a plurality of conductive pins, and the second connector includes a plurality of contact foils. The first connector of the fan is coupled to the second connector of an adjacent fan to establish both electrical and mechanical connections between the adjacent fans. An external power connector includes either the first connector or the second connector. The external power connector is coupled to a complementary connector of an outermost fan body to supply power to the fan module.

Abstract: A connection structure includes a connector with a male head at one end. The connector includes a first connecting section, an intermediate section, and a second connecting section that are sequentially connected. The connection structure also includes a movable assembly that is sleeved on the intermediate section of the connector. The movable assembly defines a movable range for the connector. When the male head is mated with a corresponding female head, the movable assembly allows the connector to move within the movable range along at least one predetermined direction to facilitate engagement between the male head and the female head. The second connecting section is configured to connect to a conduit.

Abstract: A three-dimensional heat exchanger includes a thermally conductive casing, a thermally conductive structure, a first heat pipe and a second heat pipe. The thermally conductive casing includes a bottom plate and a thermally conductive protrusion structure. The bottom plate has a first inner surface. The thermally conductive protrusion structure has a second inner surface. The thermally conductive structure is disposed on the thermally conductive protrusion structure, and has a top surface. The first heat pipe contacts the first inner surface. The second heat pipe contacts the second inner surface. An end of the first heat pipe and an end of the second heat pipe have a bottom surface, respectively. A distance between the two bottom surfaces and the second inner surface is larger than a distance between the top surface and the second inner surface.

Abstract: A three-dimensional heat transfer device configured to be thermally coupled to a heat source. The three-dimensional heat transfer device includes a thermally conductive casing having an airtight chamber and a thermal contact surface, the thermal contact surface faces away from the airtight chamber and is thermally coupled to the heat source, at least one first heat pipe disposed on the thermally conductive casing and in fluid communication with the airtight chamber, and at least one second heat pipe disposed on the thermally conductive casing and in fluid communication with the airtight chamber, wherein a cross-section of the first heat pipe is different from a cross-section of the second heat pipe, and the first heat pipe and the second heat pipe are configured to guide an airflow to a primary cooling area corresponding to the thermal contact surface.

Abstract: A vapor chamber includes a first cover and a second cover. The first cover has a thermal contact surface. The thermal contact surface is configured to be thermally coupled to a heat source. The second cover and the first cover are joined together to form an air tight space. The air tight space is configured to accommodate a cooling fluid. The thermal contact surface faces away from the air tight space. The second cover has a first surface, a second surface and at least one first support protrusion structure. The first surface faces away from the first cover. The second surface faces the first cover. The at least one first support protrusion structure protrudes from the second surface of the second cover and is in physical contact with the first cover.

Abstract: A heat dissipation device includes a plurality of cooling fans and at least one fastening device. Each cooling fan includes at least one contact region having a plurality of conductive pins and at least one first magnet. Each fastening device includes a housing having at least one cavity formed within, a contact plate disposed within the cavity, the contact plate includes a plurality of conductive contacts that are disposed on a side of the contact plate, and at least one second magnet disposed within the cavity, wherein the fastening device is configured to connect the cooling fans via the first magnet and the second magnet.

Abstract: A heat transfer device includes a first thermally conductive casing configured to contact a heat source and a second casing mounted thereon to define a liquid-tight chamber. A thermally conductive protrusion extends into the chamber. First and second capillary structures are disposed on the first casing and the protrusion, respectively, and are thermally coupled. A first heat pipe extends through the second casing and is in fluid communication with the chamber. A second heat pipe extends through the second casing, is isolated from the chamber, and is spaced from the first casing.

Abstract: A dual-system cooling apparatus includes a first cooling system having a first enclosure that encloses a first cavity and a second cooling system having a second enclosure that encloses a second cavity and has a capillary structure on an inner surface of the second enclosure. The first enclosure is positioned over the second enclosure. A first working fluid of the first cooling system is different from a second working fluid of the second cooling system.

Abstract: A thin heat pipe including a thin heat pipe container, wick structure, working fluid, and vapor flow passage section is provided. The thin heat pipe container includes a lower inner wall and upper inner wall. The wick structure is disposed on the lower inner wall and includes a first wick structure portion connected to a second wick structure portion. The vapor flow passage section is configured for vapor to flow therethrough. A thickness of the second wick structure portion is lesser than a thickness of the first wick structure portion and the second wick structure portion does not contact, contact points between the upper inner wall and lower inner wall. The wick structure defines the vapor flow passage section. The first wick structure contacts the upper inner wall and second wick structure. Working fluid is pulled from vapor condenser sections to high temperature sections via the wick structure.

Abstract: A fan module for cooling electronic devices comprises a first fan and a second fan detachably coupled together. The first fan includes a first housing having latching slots, a first engagement member defining a first engagement slot with a first opening oriented toward a corresponding latching slot, and a first fan blade disposed within the first housing. The second fan includes a second housing, a second engagement member detachably fitted in the first engagement slot of the first engagement member, and a second fan blade disposed within the second housing. A latching member is disposed in the corresponding latching slots and configured to prevent the second engagement member from disengaging from the first engagement member. When assembled, the rotational axes of the fan blades are aligned to direct airflow from the first fan into the airflow path of the second fan, providing enhanced cooling performance.

Abstract: A fan blade device includes a fan blade having a hub portion and a plurality of blade portions connected to the hub portion, each blade portion having a front surface and a back surface opposite to each other, a plurality of first airflow guiding structures disposed on the front surface and including first guiding protrusions with first microchannels formed between adjacent protrusion parts, and a plurality of second airflow guiding structures disposed on the back surface and including second guiding protrusions with second microchannels formed between adjacent protrusion parts.

Abstract: A modular cooling fan assembly includes at least two fan bodies each having an outer frame having a male connector component, and at least one connecting member having two sets of female connector components, wherein the male connector component includes a probe assembly and a ball catch assembly, wherein the female connector component includes a conductive contact configured to engage with the probe assembly to establish an electrical connection, and a limiting block configured to movably connect with the ball catch assembly, and wherein the conductive contacts of the two sets of female connector components are electrically connected to each other.

Abstract: A fan assembly, comprising at least two fan bodies each having an outer frame having a connection structure, and at least one connecting member having two sets of contact structures, wherein the connection structure includes a conductive probe and a locking protrusion, wherein the contact structure includes a conductive contact configured to mate with the conductive probe, and a limiting groove configured to mate with the locking protrusion, and wherein the conductive contacts of the two sets of contact structures are electrically connected to each other.

Abstract: A fan device includes a fan frame including a base and a frame body, a fan blade rotatably disposed on the base, and at least one first mating structure and at least one second mating structure respectively disposed on the base and the frame body. The first mating structure is configured to attract the second mating structure so that the frame body is detachably secured to the base. The base includes a shell portion and at least one first assembly portion connected to the shell portion and extending toward the frame body. The frame body includes a frame portion and at least one second assembly portion connected to the frame portion and extending toward the base. The first mating structure has a mating recess, and the second mating structure includes a first protrusion portion, a second protrusion portion, and a disc portion disposed between the first and second protrusion portions.

Abstract: A heat dissipation module includes a fan assembly and a securing device. The fan assembly includes a fan including a fan frame and a fan blade. The fan blade is rotatably disposed in the fan frame. The fan frame includes a first assembling portion and a second assembling portion and both of them are arranged along an axial direction of the fan blade. The fan assembly further includes a fastener that movably extends through the first assembling portion and the second assembling portion. The fan assembly also includes a stopper that is mounted into the fastener and located between the first assembling portion and the second assembling portion. The fastener extends through the first assembling portion and the second assembling portion and is fastened to the securing device.

Abstract: A three-dimensional heat exchanger includes a thermally conductive casing, a thermally conductive structure, a first heat pipe and a second heat pipe. The thermally conductive casing includes a bottom plate and a thermally conductive protrusion structure. The bottom plate has a first inner surface. The thermally conductive protrusion structure has a second inner surface. The thermally conductive structure is disposed on the thermally conductive protrusion structure, and has a top surface. The first heat pipe contacts the first inner surface. The second heat pipe contacts the second inner surface. An end of the first heat pipe and an end of the second heat pipe have a bottom surface, respectively. A distance between the two bottom surfaces and the second inner surface is larger than a distance between the top surface and the second inner surface.

Abstract: A heat dissipation device includes a liquid-cooling radiator assembly, a fan mounting structure disposed on the liquid-cooling radiator assembly, a plurality of recesses formed on an outer side of the mounting structure, and a plurality of contact terminals mounted in the recesses, respectively. The heat dissipation device further includes a power connector disposed on one side of the mounting structure and electrically connected to the contact terminals, and at least two fans arranged side-by-side and mounted to the fan mounting structure, each fan having a plurality of spring pins. When the fans are secured to the fan mounting structure, each of the spring pins is in electrical contact with a corresponding contact terminal to form a power supply path among the power connector, the contact terminals, and the spring pins.

Abstract: A three-dimensional heat transfer device includes a first thermally conductive casing, a second thermally conductive casing. The second thermally conductive casing is attached to the first thermally conductive casing to form a liquid-tight chamber. The heat transfer device further includes thermally conductive protrusions, first capillary structures that are disposed on the first thermally conductive casing, second capillary structures that are disposed on the thermally conductive protrusions and are thermally coupled with the first capillary structure, and first heat pipes that are extended through the first through holes and are in contact with the second capillary structures. In at least one the first pipes, a fourth capillary structures are disposed on an inner wall of the first heat pipe and is in contact with the second capillary.

Abstract: A fan module for cooling electronic devices comprises a first fan and a second fan detachably coupled together. The first fan includes a first housing having latching slots, a first engagement member defining a first engagement slot with a first opening oriented toward a corresponding latching slot, and a first fan blade disposed within the first housing. The second fan includes a second housing, a second engagement member detachably fitted in the first engagement slot of the first engagement member, and a second fan blade disposed within the second housing. A latching member is disposed in the corresponding latching slots and configured to prevent the second engagement member from disengaging from the first engagement member. When assembled, the rotational axes of the fan blades are aligned to direct airflow from the first fan into the airflow path of the second fan, providing enhanced cooling performance.

Abstract: A thin heat pipe including a thin heat pipe container, wick structure, working fluid, and vapor flow passage section is provided. The thin heat pipe container includes a lower inner wall and upper inner wall. The wick structure is disposed on the lower inner wall and includes a first wick structure portion connected to a second wick structure portion. The vapor flow passage section is configured for vapor to flow therethrough. A thickness of the second wick structure portion is lesser than a thickness of the first wick structure portion and the second wick structure portion does not contact, contact points between the upper inner wall and lower inner wall. The wick structure defines the vapor flow passage section. The first wick structure contacts the upper inner wall and second wick structure. Working fluid is pulled from vapor condenser sections to high temperature sections via the wick structure.