Abstract: A light emitting fan including a first light guide, light source component, chassis, second light guide, plurality of blades rotatably mounted to the chassis, cover, and at least one fastening assemblage is provided. The first light guide has a plurality of different first light emitting surfaces. The second light guide has a plurality of different second light emitting surfaces. The at least one fastening assemblage comprises a first cavity structure, a second cavity structure, and a pair of arms. The first cavity structure is integrated with the cover, the second cavity structure is integrated with the chassis, and the pair of arms is integrated with the first light guide. The at least one fastening assemblage removably interlocks the cover and light source component with the first light guide and removably interlocks the chassis and second light guide with the first light guide.

Abstract: A heat pipe has a tube and an evaporator wick. The tube has multiple groove structures, an evaporator section, and a condenser section. The groove structures are disposed on an inner surface of the tube and extend to two opposite ends of the tube to reduce flow resistance of liquid phase working fluid. The evaporator wick is disposed in the evaporator section. The evaporator wick is made of metal powder and sintered to adhere to the groove structures. The evaporator wick is uniform in thickness and uniformly adheres to the groove structures. The evaporator wick vaporizes the working fluid in the evaporator section. As a result, the heat pipe has good manufacturing process repeatability and is reliable, easy to manufacture, and low-cost.

Abstract: A composite heat dissipation device includes a heat dissipation fin unit having a hollow portion, a rotating member disposed on the hollow portion, and a fan unit including a main shaft connected to the rotating member. The fan unit is configured to drive the rotating member to rotate via the main shaft. The heat dissipation fin unit may include a base, a connecting cylinder, and at least one heat dissipation fin. The composite heat dissipation device may further include a thermal conduction cylinder disposed within the connecting cylinder, defining a thermal conduction channel, and an isolation member disposed within the thermal conduction cylinder adjacent to the rotating member. The rotating member may include a ring groove and a first protrusion portion having a curved surface, wherein the curved surface, the first protrusion portion, and the ring groove together define a heat-absorbing surface. The isolation member may include a second protrusion portion and a ring recess.

Abstract: A fan circuit for a server including a microcontroller unit (MCU) module, a high-voltage hot-swap soft-start switching circuit configured to receive power from an external power supply, a three-phase inverter bridge circuit, a ?-type filter circuit electrically connected between the high-voltage hot-swap soft-start switching circuit and the three-phase inverter bridge circuit, a motor, and a bus current detection overcurrent protection circuit configured to detect a bus current of the three-phase inverter bridge circuit and provide a corresponding detection signal to the MCU module. The three-phase inverter bridge circuit having upper bridge arms electrically connected to control terminals of the MCU module and lower bridge arms electrically connected to the motor.

Abstract: A plurality of fans for use in a fan module that is configured to allow tool-free assembly and disassembly, at least one of the fans includes either a first connector and a second connector, two first connectors, or two second connectors, where the first connector and the second connector are complementary. The first connector includes a plurality of conductive pins, and the second connector includes a plurality of contact foils. The first connector of the fan is coupled to the second connector of an adjacent fan to establish both electrical and mechanical connections between the adjacent fans. An external power connector includes either the first connector or the second connector. The external power connector is coupled to a complementary connector of an outermost fan body to supply power to the fan module.

Abstract: A connection structure includes a connector with a male head at one end. The connector includes a first connecting section, an intermediate section, and a second connecting section that are sequentially connected. The connection structure also includes a movable assembly that is sleeved on the intermediate section of the connector. The movable assembly defines a movable range for the connector. When the male head is mated with a corresponding female head, the movable assembly allows the connector to move within the movable range along at least one predetermined direction to facilitate engagement between the male head and the female head. The second connecting section is configured to connect to a conduit.

Abstract: A three-dimensional heat exchanger includes a thermally conductive casing, a thermally conductive structure, a first heat pipe and a second heat pipe. The thermally conductive casing includes a bottom plate and a thermally conductive protrusion structure. The bottom plate has a first inner surface. The thermally conductive protrusion structure has a second inner surface. The thermally conductive structure is disposed on the thermally conductive protrusion structure, and has a top surface. The first heat pipe contacts the first inner surface. The second heat pipe contacts the second inner surface. An end of the first heat pipe and an end of the second heat pipe have a bottom surface, respectively. A distance between the two bottom surfaces and the second inner surface is larger than a distance between the top surface and the second inner surface.

Abstract: A three-dimensional heat transfer device configured to be thermally coupled to a heat source. The three-dimensional heat transfer device includes a thermally conductive casing having an airtight chamber and a thermal contact surface, the thermal contact surface faces away from the airtight chamber and is thermally coupled to the heat source, at least one first heat pipe disposed on the thermally conductive casing and in fluid communication with the airtight chamber, and at least one second heat pipe disposed on the thermally conductive casing and in fluid communication with the airtight chamber, wherein a cross-section of the first heat pipe is different from a cross-section of the second heat pipe, and the first heat pipe and the second heat pipe are configured to guide an airflow to a primary cooling area corresponding to the thermal contact surface.

Abstract: A vapor chamber includes a first cover and a second cover. The first cover has a thermal contact surface. The thermal contact surface is configured to be thermally coupled to a heat source. The second cover and the first cover are joined together to form an air tight space. The air tight space is configured to accommodate a cooling fluid. The thermal contact surface faces away from the air tight space. The second cover has a first surface, a second surface and at least one first support protrusion structure. The first surface faces away from the first cover. The second surface faces the first cover. The at least one first support protrusion structure protrudes from the second surface of the second cover and is in physical contact with the first cover.

Abstract: A heat dissipation device includes a plurality of cooling fans and at least one fastening device. Each cooling fan includes at least one contact region having a plurality of conductive pins and at least one first magnet. Each fastening device includes a housing having at least one cavity formed within, a contact plate disposed within the cavity, the contact plate includes a plurality of conductive contacts that are disposed on a side of the contact plate, and at least one second magnet disposed within the cavity, wherein the fastening device is configured to connect the cooling fans via the first magnet and the second magnet.

Abstract: A heat transfer device includes a first thermally conductive casing configured to contact a heat source and a second casing mounted thereon to define a liquid-tight chamber. A thermally conductive protrusion extends into the chamber. First and second capillary structures are disposed on the first casing and the protrusion, respectively, and are thermally coupled. A first heat pipe extends through the second casing and is in fluid communication with the chamber. A second heat pipe extends through the second casing, is isolated from the chamber, and is spaced from the first casing.

Abstract: A dual-system cooling apparatus includes a first cooling system having a first enclosure that encloses a first cavity and a second cooling system having a second enclosure that encloses a second cavity and has a capillary structure on an inner surface of the second enclosure. The first enclosure is positioned over the second enclosure. A first working fluid of the first cooling system is different from a second working fluid of the second cooling system.

Abstract: A thin heat pipe including a thin heat pipe container, wick structure, working fluid, and vapor flow passage section is provided. The thin heat pipe container includes a lower inner wall and upper inner wall. The wick structure is disposed on the lower inner wall and includes a first wick structure portion connected to a second wick structure portion. The vapor flow passage section is configured for vapor to flow therethrough. A thickness of the second wick structure portion is lesser than a thickness of the first wick structure portion and the second wick structure portion does not contact, contact points between the upper inner wall and lower inner wall. The wick structure defines the vapor flow passage section. The first wick structure contacts the upper inner wall and second wick structure. Working fluid is pulled from vapor condenser sections to high temperature sections via the wick structure.

Abstract: A fan module for cooling electronic devices comprises a first fan and a second fan detachably coupled together. The first fan includes a first housing having latching slots, a first engagement member defining a first engagement slot with a first opening oriented toward a corresponding latching slot, and a first fan blade disposed within the first housing. The second fan includes a second housing, a second engagement member detachably fitted in the first engagement slot of the first engagement member, and a second fan blade disposed within the second housing. A latching member is disposed in the corresponding latching slots and configured to prevent the second engagement member from disengaging from the first engagement member. When assembled, the rotational axes of the fan blades are aligned to direct airflow from the first fan into the airflow path of the second fan, providing enhanced cooling performance.

Abstract: A fan blade device includes a fan blade having a hub portion and a plurality of blade portions connected to the hub portion, each blade portion having a front surface and a back surface opposite to each other, a plurality of first airflow guiding structures disposed on the front surface and including first guiding protrusions with first microchannels formed between adjacent protrusion parts, and a plurality of second airflow guiding structures disposed on the back surface and including second guiding protrusions with second microchannels formed between adjacent protrusion parts.

Abstract: A modular cooling fan assembly includes at least two fan bodies each having an outer frame having a male connector component, and at least one connecting member having two sets of female connector components, wherein the male connector component includes a probe assembly and a ball catch assembly, wherein the female connector component includes a conductive contact configured to engage with the probe assembly to establish an electrical connection, and a limiting block configured to movably connect with the ball catch assembly, and wherein the conductive contacts of the two sets of female connector components are electrically connected to each other.

Abstract: A fan assembly, comprising at least two fan bodies each having an outer frame having a connection structure, and at least one connecting member having two sets of contact structures, wherein the connection structure includes a conductive probe and a locking protrusion, wherein the contact structure includes a conductive contact configured to mate with the conductive probe, and a limiting groove configured to mate with the locking protrusion, and wherein the conductive contacts of the two sets of contact structures are electrically connected to each other.

Abstract: A fan device includes a fan frame including a base and a frame body, a fan blade rotatably disposed on the base, and at least one first mating structure and at least one second mating structure respectively disposed on the base and the frame body. The first mating structure is configured to attract the second mating structure so that the frame body is detachably secured to the base. The base includes a shell portion and at least one first assembly portion connected to the shell portion and extending toward the frame body. The frame body includes a frame portion and at least one second assembly portion connected to the frame portion and extending toward the base. The first mating structure has a mating recess, and the second mating structure includes a first protrusion portion, a second protrusion portion, and a disc portion disposed between the first and second protrusion portions.

Abstract: A heat dissipation module includes a fan assembly and a securing device. The fan assembly includes a fan including a fan frame and a fan blade. The fan blade is rotatably disposed in the fan frame. The fan frame includes a first assembling portion and a second assembling portion and both of them are arranged along an axial direction of the fan blade. The fan assembly further includes a fastener that movably extends through the first assembling portion and the second assembling portion. The fan assembly also includes a stopper that is mounted into the fastener and located between the first assembling portion and the second assembling portion. The fastener extends through the first assembling portion and the second assembling portion and is fastened to the securing device.

Abstract: A three-dimensional heat exchanger includes a thermally conductive casing, a thermally conductive structure, a first heat pipe and a second heat pipe. The thermally conductive casing includes a bottom plate and a thermally conductive protrusion structure. The bottom plate has a first inner surface. The thermally conductive protrusion structure has a second inner surface. The thermally conductive structure is disposed on the thermally conductive protrusion structure, and has a top surface. The first heat pipe contacts the first inner surface. The second heat pipe contacts the second inner surface. An end of the first heat pipe and an end of the second heat pipe have a bottom surface, respectively. A distance between the two bottom surfaces and the second inner surface is larger than a distance between the top surface and the second inner surface.