Abstract: A method and apparatus are described for allowing the testing and monitoring of an increased number of devices on a standard burn-in board by implementing a PLD and a group of switches to get the result of a multiplexor on the burn-in board. The test data output (TDO) signals from the intergrated circuit devices are segmented into groups, with each group of TDO signals transmitted to a particular group of switches. A programmable logic device is coupled to the groups of switches such that a specific group of switches may be selected to transmit the TDO signals of the selected group of switches. The remaining groups of switches are selected, in turn, until all of the TDO signals have been transmitted. Thus, the TDO signals from an increased number of intergrated circuit devices may be transmitted, serially, via a limited number of monitoring channels.

Abstract: A method and apparatus are described for allowing the testing and monitoring of an increased number of device on a standard burn-in board by implementing a PLD and a group of switches to get the result of a multiplexor on the burn-in board. The test data output (TDO) signals from the integrated circuit devices are segmented into groups, with each group of TDO signals transmitted to a particular group of switches. A programmable logic device is coupled to the groups of switches such that a specific group of switches may be selected to transmit the TDO signals of the selected group of switches. The remaining groups of switches are selected, in turn, until all of the TDO signals have been transmitted. Thus, the TDO signals from an increased number of integrated circuit devices may be transmitted, serially, via a limited number of monitoring channels.

Abstract: An apparatus for testing an integrated circuit in an oven during burn-in. A burn-in board in the oven is electrically connected to a plurality of integrated circuit (“ICE”) components. A driver/interface board outside the oven is electrically connected to the burn-in board through a plurality of contacts and sends and receives a plurality of signals between the IC components and a test controller. A switch module on the burn-in board comprises a plurality of high-temperature switches for transferring signals between the plurality of IC components and the driver/interface board during burn-in. A plurality of signals entering the switch module from the driver/interface board does not exceed in number the plurality of contacts, and is fewer in number than a plurality of signals exiting the switch module to the plurality of IC components.

Abstract: An apparatus for testing an integrated circuit in an oven during burn-in. A burn-in board in the oven is electrically connected to a plurality of integrated circuit ("IC") components. A driver/interface board outside the oven is electrically connected to the burn-in board through a plurality of contacts and sends and receives a plurality of signals between the IC components and a test controller. A switch module on the burn-in board comprises a plurality of high-temperature switches for transferring signals between the plurality of IC components and the driver/interface board during burn-in. A plurality of signals entering the switch module from the driver/interface board does not exceed in number the plurality of contacts, and is fewer in number than a plurality of signals exiting the switch module to the plurality of IC components.

Abstract: An apparatus for testing an integrated circuit in an oven during burn-in. A burn-in board in the oven is electrically connected to a plurality of integrated circuit ("IC") components. A driver/interface board outside the oven is electrically connected to the burn-in board through a plurality of contacts and sends and receives a plurality of signals between the IC components and a test controller. A switch module on the burn-in board comprises a plurality of high-temperature switches for transferring signals between the plurality of IC components and the driver/interface board during burn-in. A plurality of signals entering the switch module from the driver/interface board does not exceed in number the plurality of contacts, and is fewer in number than a plurality of signals exiting the switch module to the plurality of IC components.

Abstract: An apparatus for testing an integrated circuit in an oven during burn-in. A burn-in board in the oven is electrically connected to a plurality of integrated circuit ("IC") components. A driver/interface board outside the oven is electrically connected to the burn-in board through a plurality of contacts and sends and receives a plurality of signals between the IC components and a test controller. A switch module on the burn-in board comprises a plurality of high-temperature switches for transferring signals between the plurality of IC components and the driver/interface board during burn-in. A plurality of signals entering the switch module from the driver/interface board does not exceed in number the plurality of contacts, and is fewer in number than a plurality of signals exiting the switch module to the plurality of IC components.

Abstract: The present invention provides a driver board which can be used with a wide range of test patterns and devices, and includes the capability to modify the edge connector configuration. The driver board contains a CPU module for communicating with a host computer. The board also utilizes SRAM for test pattern memory. The board can be used to sense output of the devices under test to determine when failures have occurred. The device can optionally be provided with JTAG capability, analog channels and high frequency clocks. In a particularly preferred embodiment, the test pattern memory is provided on a separate board which can be plugged into the main board.