Abstract: A LED lamp cup includes a heat-conducting substrate, a LED unit, a casing and a light-transmitting lamp cover. The casing can be detachably assembled with the heat-conducting substrate or the light-transmitting lamp cover easily. Further, the casing or the light-transmitting lamp cover is configured that it can be retained from outside toward inside, so that the casing may not rotated reversely after being assembled with the heat-conducting substrate or the light-transmitting lamp cover. Thus, the biasing force exerted on the first and second waterproof gaskets may not be reduced to enlarge the gap. Thus, the penetration of moisture can be prevented to achieve a good waterproof effect.

Abstract: An LED lamp with heat dissipation mechanism having double heat pipe and tridimensional LEDs arrangement is disclosed. The lamp is composed of a heat-dissipation unit, a heat pipe whose one end is mounted on the heat-dissipation unit, a plurality of LED units mounted on an outer surface of the heat pipe, a fin module encompassing the heat-dissipation unit and a reflector mounted on a bottom of the heat-dissipation unit. The heat-dissipation unit has two basin-like casings. The LED units on the heat pipe are towards the reflector. Thus the reflector concentrates the light from the LED units.

Abstract: A structure of LED of high heat-conducting efficiency is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein.

Abstract: A structure of a tag integrated circuit flexible board includes a base material, one surface thereof having an adhesive layer; and a plurality of integrated circuit flexible boards that are arranged adjacent to one another and adhered on the adhesive layer of the base material. The integrated circuit flexible board includes an insulating heat-conductive material, and a conductive circuit layer provided on a surface of the insulating heat-conductive material and formed of a plurality of sections of circuits.

Abstract: A packaging method of LED of high heat-conducting efficiency and a structure thereof firstly is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein.

Abstract: A heat-dissipating model includes a heat-conducting member and a heat-dissipating body. The heat-conducting member has a hollow cylinder with a closed end. The interior of the wall of the cylinder is formed with a vacuum chamber. The vacuum chamber is provided with a capillary structure and a working fluid therein. The heat-dissipating body has a through hole for connecting to the outer periphery of the heat-conducting member. Further, the periphery of the heat-dissipating body is provided with a plurality of heat-dissipating fins. With the above arrangement, the heat generated by the heat source can be dissipated to a far place, so that it can be continuously operated at a lower temperature. As a result, the effect of heat conduction or dissipation can be improved and the life is extended.

Abstract: An LED lamp conducting structure includes plate-type heat pipe of mask shape. A support plate mounted with LEDs is fixed on a plate-type heat pipe and then is placed within a lampshade. The plate-type heat pipe is made of metal with good thermal conductivity and has a plurality of through holes defined on bottom thereof. The support plate includes a plurality of electrode holes corresponding to the through holes. The anode contact and cathode contact of the LED are around the electrode hole. The contacts are exposed out of the support plate such that two screw-shaped electrode pins can be connected to the contacts after passing the electrode holes and the through holes. The electrode pins are locked to the plate-type heat pipe by screw such that the electrode pins have electrical connection with the contacts.

Abstract: A light source structure of a backlight module includes a casing, a heat sink, a plurality of light source generators, a first reflecting element and a second reflecting element. If a light emitting component of the light source generator is lit, a spot light source of the light emitting component is passed through an optical lens in a light pipe and converted into a linear light source to be projected onto an oblique surface of the first reflecting element. The oblique surface converts the linear light source into a planar light source to be projected from an opening of a casing to an oblique surface of the second reflecting element. The oblique surface of the second reflecting element guides the planar light source into the light guide plate, such that the light in the light guide plate is diffused uniformly to provide sufficient brightness to the light guide plate.

Abstract: An LED illumination apparatus includes a lamp housing, an LED module, distal covers and a light-transmitting hood. The lamp housing has a base, a heat sink at the top of the base, a heat dissipating channel between two adjacent heat sinks, and a receiving portion on an internal side of the base. The LED module includes a fixing base, a lampshade on a side of the fixing base, a plurality of LED lamps in the lampshade, and a connecting portion on the fixing base and coupled to the corresponding receiving portion. Each distal cover seals the front and back of the lamp housing, and the light-transmitting hood is connected under the lamp housing, and a containing space enclosed by the lamp housing, distal cover and light-transmitting hood for installing the LED module. The invention can simplify the manufacturing processes and reduce the material cost and development time.