Abstract: A device for applying a solder paste, a glue or another similar material in patches on a substrate includes a supply of material, an outlet, connected to the supply by a conveying conduit, and an arrangement for intermittently forcedly discharging the material in successive small quantities through the outlet. In order to counteract any sedimentation within the conveying conduit, the conduit is formed as a closed loop which contains a pump for feeding the material in a continuous circulating flow therethrough and past the outlet. The outlet includes a discharge opening, provided in the wall of the conveying conduit and through which the material may be thrown out in small quantities by the aid of the arrangement for intermittently forcedly discharging the material, which transiently increases the pressure in the conveying conduit within a zone located adjacent to the discharge opening.

Abstract: In order to significantly intensify the pump action in a piezoelectric pump without long-term, negative consequences, and in order to be able to employ a great variety of fluids, the pump of the invention is formed of piezoceramic parts arranged essentially parallel to and at a distance from one another. They are provided with electrical contacts at both sides, and are covered at both sides with closure means. The cavity between the piezoceramic parts and the closure means forms the pump channel. The electrical contacts lie essentially perpendicular relative to the closure means. The polarization direction in the piezoceramic parts lies parallel to the electrical field strength. A multi-channel pump, particularly for an ink-jet matrix printer means, can be manufactured in an especially simple way by use of known semiconductor manufacturing techniques.