Abstract: A semiconductor memory chip including error correction circuitry configured to receive data words from an external device, each data word comprising a binary number of data bits, and configured to error encode each data word to form a corresponding coded word comprising a non-binary number of data bits including the data bits of the data word and a plurality of error correction code bits. At least one memory cell array is configured to receive and store the coded word and partitioned based on the non-binary number of bits of the coded word so as to have a non-binary number of wordlines and provide the memory chip with an aspect ratio other than a 2:1 aspect ratio.

Abstract: A method for operating a memory apparatus which comprises at least two memory devices, each memory device containing at least one bank, comprising: activation of at least one word line in at least one bank on the basis of a row activation command; storage of bank information, the bank information indicating which banks per memory device contain a word line activated by the row activation command; reading/writing of memory contents from/to banks with activated word lines on the basis of the bank information.

Abstract: A memory module includes a plurality of memory devices and a stacked error correction code memory device. The plurality of memory devices includes one or more memory chips arranged in a plurality of ranks. The stacked error correction code memory device includes a plurality of error correction code memory chips. The number of error correction code memory chips is at least one more than the number of the one or more memory chips. Each of the error correction code memory chips are arranged together with the memory chips of one of the ranks.

Abstract: An integrated circuit including a memory element and method for manufacturing the integrated circuit are described. In some embodiments, the memory element includes a switching layer that selectively switches between a low resistance state and a high resistance state, and a positive temperature coefficient layer in thermal contact with the switching layer, the positive temperature coefficient layer having a resistance that increases in response to an increase in temperature.

Abstract: Embodiment of the present invention relate to a method for receiving a first signal, determining a first characteristic of the first signal, the characteristic being a time based characteristic, receiving a second signal and processing the second signal through a predetermined range of delay elements, an initial minimum number of delay elements in the predetermined range being adjustable, the processed second signal having a second characteristic substantially corresponding to the first characteristic of the first signal.

Abstract: An integrated circuit having a semiconductor substrate with a barrier layer is disclosed. The arrangement includes a semiconductor substrate and a metallic element. A carbon-based barrier layer is disposed between the semiconductor substrate and the metallic element.

Abstract: An integrated circuit includes a bit line, a plurality of access devices coupled to the bit line, and a plate of phase change material. The integrated circuit includes a plurality of phase change elements contacting the plate of phase change material and a plurality of first contacts. Each first contact is coupled between an access device and a phase change element.

Abstract: An integrated device is disclosed. In one embodiment, the integrated device includes a carrier substrate with a through hole and a contact sleeve. A circuit chip is provided with a contact pad above the carrier substrate. A conductive material electrically connects the contact pad to the contact sleeve.

Abstract: A memory cell includes a first electrode, a second electrode, and phase-change material including a first portion contacting the first electrode, a second portion contacting the second electrode, and a third portion between the first portion and the second portion. A width of the third portion is less than a width of the first portion and a width of the second portion.

Abstract: A refresh scheduler is configured to refresh memory cells of a memory device according to a plurality of refresh intervals. The various refresh intervals are determined in response to refresh errors.

Abstract: A memory cell includes a first electrode, a second electrode, and a first portion of phase-change material contacting the first electrode. The memory cell includes a second portion of phase-change material contacting the second electrode and a third portion of phase-change material between the first portion and the second portion. A phase-change material composition of the third portion and the second portion gradually transitions from the third portion to the second portion.

Abstract: An article including a substrate having a blind hole formed therein, wherein the blind hole is defined by a floor and a sidewall and a solder connection is provided. The solder connection may couple a first contact pad to a second contact pad. The first contact pad may cover a first field of the floor of the blind hole, and may also promote wetting of a solder material of the solder connection. Wetting may be impeded on a second field of the floor of the blind hole. The second contact pad may be arranged above a surface of a further substrate, wherein the surface of the further substrate may be oriented perpendicularly to the floor of the blind hole in the substrate.

Abstract: The invention relates to a method for making a semiconductor. In one embodiment the method includes applying an adhesive layer to ground-thin or thinned semiconductor chips of a semiconductor wafer. In this embodiment, the adhesive layer composed of curable adhesive is introduced relatively early into a method for the thinning by grinding, separation and singulation of a semiconductor wafer to form thinned semiconductor chips, and is used further in a semiconductor device into which the thinned semiconductor chip is to be incorporated.

Abstract: A memory including an array of memory cells and a control circuit. The control circuit is configured to control partial array self refreshes and to switch from one partial array self refresh to another partial array self refresh. Data in memory cells that are refreshed via the one partial array self refresh and refreshed via the other partial array self refresh is retained in the memory cells from before a first switch from the one partial array self refresh to the other partial array self refresh to after the first switch.

Abstract: An integrated circuit includes memory segments, each having at least one memory cell configurable in first and second states to store data, and a controller that controls programming and erasing of the memory segments. The controller maps external memory addresses of write data to internal memory addresses of erased memory segments with no memory cells in the first state such that erased memory segments are programmed with write data. When a write access occurs for an external memory address previously mapped to an internal memory address of a programmed memory segment with at least one memory cell in the first state, the controller remaps the external memory address to another internal memory address of an erased memory segment. The controller identifies programmed memory segments to be erased and controls selective erasure of the identified programmed memory segments, such as programmed memory segments no longer mapped to an external memory address.

Abstract: One aspect of the invention relates to a voltage regulation process as well as to a voltage regulation system. A first voltage, present at an input of the voltage regulating system, is changed into a second voltage, which can be tapped at an output of the voltage regulation system, with a first device for generating an essentially constant voltage from the first voltage, or a voltage derived from it. A further device is provided for generating a further voltage from the first voltage or a voltage derived from it, in particular a voltage which can be higher than the voltage generated by the first device.

Abstract: A memory system, in particular a buffered memory system, e.g., a fully buffered memory system, a method for operating a memory system, and a device for use with a memory system is disclosed. The memory system may include a first buffered memory module, and a second buffered memory module, wherein the first and the second buffered memory modules are adapted to be accessed in parallel. According to a further embodiment of the invention, a device is provided which is adapted to map consecutive accesses to the first or the second memory module to a parallel access of both the first and the second memory module.

Abstract: Techniques and corresponding circuits for achieving programmable delay of a current mode logic delay buffer are provided. The techniques provide for incremental delay with substantially equal increments. Delay may be achieved through the use of a circuit arrangement that allows biasing current to be controlled effect the response time of the circuit by digital control.

Abstract: A chip arrangement includes a logic chip with electric contacts arranged on one side, at least one memory chip arrangement with electrical contacts arranged on at least one side, and a substrate with electrical contacts on both sides of the substrate. The logic chip is attached to the substrate and is electrically conductively coupled to the substrate. The memory chip arrangement is arranged on the logic chip on the side facing the substrate and is electrically conductive coupled to the logic chip. The substrate includes a plurality of electrical connections between the contacts of the one and the other side.

Abstract: A device for reducing mutual crosstalk of a signal routed across a first line and a second signal routed across a second line, wherein by the mutual crosstalk at an output of the first line a first interfered signal may be obtained and at an output of the second line a second interfered signal may be obtained, comprising a modifier for modifying the first interfered signal that is interfered by crosstalk due to the second signal, and for modifying the second interfered signal that is interfered by crosstalk due to the first signal, wherein the modifier is adapted to model an interference due to the mutual crosstalk, and a combiner for combining the first interfered signal with the modified second interfered signal to obtain a first corrected signal and for combining the second interfered signal with the modified first interfered signal to obtain a second corrected signal.