Patents Assigned to QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
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Patent number: 12369275Abstract: A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber.Type: GrantFiled: March 31, 2023Date of Patent: July 22, 2025Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTDInventors: Fu-Yun Shen, Hsiao-Ting Hsu, Ming-Jaan Ho
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Patent number: 12320718Abstract: A pressure sensing circuit board includes a dielectric layer, a wiring layer, a strain layer, and a protective layer. The wiring layer is on the dielectric layer. The strain layer is on the dielectric layer having the line layer. The protective layer is on the wiring layer and the strain layer. The pressure sensing circuit board includes a first copper area, a second copper area, and a copper free area. The wiring layer is located in the first copper area and the second copper area. A thickness of the line layer in the first copper area is greater than that in the second copper area, and the wiring layer in the second copper area is mesh-shaped. The strain layer is in the copper free zone and connected to the line layer. The protective layer is on the wiring layer in the second copper area and covers the strain layer.Type: GrantFiled: December 28, 2022Date of Patent: June 3, 2025Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTDInventors: Fu-Yun Shen, Hsiao-Ting Hsu, Ming-Jaan Ho
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Patent number: 12245358Abstract: A circuit board includes a circuit substrate. The circuit substrate includes an insulating substrate and an electronic component embedded therein. The insulating substrate defines two first slots. A first phase change material fills in the two first slots and thermally connects to the electronic component. A first wiring layer is formed on a surface of the insulating substrate, the first wiring layer covers the two first slots and thermally connects to the first phase change material. A second wiring layer is formed on another surface of the insulating substrate. The second wiring layer includes a plurality of wiring portions and a wiring slot formed between adjacent wiring portions. The electronic component electrically connects to the second wiring portion. A second phase change material fills in at least one wiring slot and thermally connects a portion of the wiring portions together to form a heat dissipation zone.Type: GrantFiled: March 23, 2023Date of Patent: March 4, 2025Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited., GARUDA TECHNOLOGY CO., LTD.Inventors: Ying Wang, Yong-Quan Yang
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Patent number: 12238871Abstract: A component embedded circuit board includes a printed circuit board, a dielectric layer, and an antenna structure laminated in that order. The printed circuit board includes a first opening and a first circuit layer, and the first circuit layer includes at least one first connecting pad. A second opening is defined in the dielectric layer. A conductive structure is embedded in the dielectric layer. The second opening penetrates the dielectric layer. The antenna structure includes a first ground layer. A component is embedded in the first opening. One end of the conductive structure is connected to the first ground layer, and the other end of the conductive structure is connected to the first connecting pad. The second opening corresponds to the first opening. A gap is generated by the second opening and the component. A method for manufacturing the package circuit structure is also disclosed.Type: GrantFiled: October 8, 2021Date of Patent: February 25, 2025Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.Inventors: Yong-Chao Wei, Yong-Quan Yang
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Patent number: 12219258Abstract: An anti-shake assembly with reduced size is disclosed which includes a circuit board, a photosensitive chip, and a magnetic component. The circuit board includes a first rigid board, a second rigid board, a plurality of connectors, and a plurality of coils. The first rigid board has a housing space. The second rigid board is movably housed in the housing space. The connectors are flexibly connected between the first rigid board and the second rigid board. The photosensitive chip and the coils are provided on the second rigid board. The magnetic component includes a base and a plurality of magnets. The base includes a central plate and a side plate. The side plate is arranged around a periphery of the central plate to form a housing space. The magnets are provided on the central plate facing the housing space. The magnets are arranged opposite to the coils.Type: GrantFiled: January 9, 2023Date of Patent: February 4, 2025Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTDInventors: Cheng-Yi Yang, Qiang Song, Yan-Qiong He, Yao-Cai Li, Biao Li, Zu-Ai Li, Mei-Hua Huang
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Patent number: 12184979Abstract: A camera module having OIS function and its preparation method are provided. The camera module includes a housing and an optical assembly in the housing, and further includes a circuit board in the housing. The circuit board includes a first board and a second board on the first board. The first board is flexible. The first board includes a first portion, a second portion, and a third portion successively connected in an extending direction of the first board. The second portion defines a slot. The second board is on the third portion. The optical assembly is on the second board. The first portion includes a fixed end connecting the second portion and an opposite free end. The housing defines a through hole. The first portion extends through the slot to form a bent portion and extends out of the through hole, such that the free end is outside the housing.Type: GrantFiled: June 29, 2021Date of Patent: December 31, 2024Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTDInventors: Xue-Feng She, Qiang Song, Mei-Hua Huang, Ning Hou
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Patent number: 12153252Abstract: A method for manufacturing a photoelectric composite circuit board, includes providing a copper-clad carrier and an intermediate circuit, the copper-clad carrier includes a substrate layer and a bottom copper layer, a first groove is defined on the intermediate circuit. Forming an optical fiber in the first groove. Forming a first accommodating groove and a second accommodating groove at each end the optical fiber. Accommodating a first coupling element in the first accommodating groove. Removing the substrate layer. Removing the bottom copper layer corresponding to the optical fiber, the intermediate circuit on one side of the optical fiber and the bottom copper layer forming a first circuit substrate, the intermediate circuit on another side of the optical fiber and the bottom copper layer forming a second circuit substrate. Electrically connecting a chip to the first circuit substrate, and electrically connecting an electronic component to the second circuit substrate.Type: GrantFiled: July 31, 2023Date of Patent: November 26, 2024Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, GARUDA TECHNOLOGY CO., LTD.Inventor: Wei-Liang Wu
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Patent number: 12156348Abstract: An embedded circuit board, made without gas bubbles or significant internal gaps according to a manufacturing method which is provided, includes an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces and a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.Type: GrantFiled: December 28, 2023Date of Patent: November 26, 2024Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.Inventors: Cheng-Yi Yang, Hao-Wen Zhong, Biao Li, Ming-Jaan Ho, Ning Hou
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Patent number: 12101891Abstract: A manufacturing method of a circuit board includes: providing a first double-sided copper laminate including a dielectric layer, a first copper foil layer and a copper plating layer, wherein the dielectric layer, wherein the dielectric layer defines a groove, the copper plating layer includes a first copper plating portion in the groove and a second copper plating portion beside the first copper plating portion. A double-sided circuit substrate including base layer and two first wiring layers is provided, wherein each first wiring layer includes a signal line. Conductive paste blocks are disposed in the base layer and on both sides of the signal line; and a first double-sided copper laminate is stacked on each side of the double-sided circuit substrate, disposing the signal line in the groove. The conductive paste blocks are pressed electrically connect same to the second copper plating portions. The present disclosure further provides a circuit board.Type: GrantFiled: May 20, 2020Date of Patent: September 24, 2024Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTDInventors: Chao Peng, Ke He, Chih-Hung Chen
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Patent number: 12101871Abstract: A circuit board utilizing thermocouples for improved heat dissipation performance from circuit boards includes a heat dissipation module which itself includes a first circuit substrate, a thermocouple, and a second circuit substrate. The first circuit substrate includes a first wiring layer comprising first and second wiring portions. The thermocouple includes a P-type and an N-type semiconductor. The second circuit substrate includes a second wiring layer with a third wiring portion. Conductive members electrically connect the P-type semiconductor with the first wiring portion, connect the P-type semiconductor with the third wiring portion, connect the N-type semiconductor with the second wiring portion, and connect the N-type semiconductor with the third wiring portion, to transfer away heat generated by working elements mounted on the board.Type: GrantFiled: June 20, 2022Date of Patent: September 24, 2024Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, GARUDA TECHNOLOGY CO., LTD.Inventors: Huan-Yu He, Mei-Hua Huang, Biao Li, Jin-Cheng Wu
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Patent number: 12082352Abstract: A flexible circuit board includes two first wiring boards, a first adhesive, and a first conductive structure. Each of the two first wiring boards includes a first bent portion, and two first bent portions of the two wiring boards is connected to each other. The first adhesive layer is sandwiched between the two first bent portions. The first conductive structure penetrates the two first bent portions and the first adhesive layer and electrically connects the two first bent portions.Type: GrantFiled: July 21, 2022Date of Patent: September 3, 2024Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, GARUDA TECHNOLOGY CO., LTD.Inventors: Yao-Cai Li, Biao Li, Hao-Wen Zhong
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Patent number: 12063752Abstract: A circuit board includes first circuit substrate and second circuit substrate; first circuit substrate includes: a first base layer arranged on the first circuit layer and a plurality of first conductive bodies on the substrate layer; the first circuit layer includes a hot pressing area and a non-hot pressing area except the hot pressing area. One end of the first conductive body is electrically connected to the hot pressing area and the other end is exposed to the first base layer; second circuit substrate includes: a second base layer, a second base layer arranged on the second circuit layer and a plurality of second conductive bodies; one end of the second conductive body is electrically connected to the second circuit layer, and the other end is exposed on the second base layer; The body is electrically connected to the second conductive body.Type: GrantFiled: May 29, 2020Date of Patent: August 13, 2024Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTDInventors: Wen-Zhu Wei, Ming-Jaan Ho, Fu-Yun Shen, Hong-Yan Guo
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Patent number: 12063750Abstract: A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.Type: GrantFiled: November 2, 2022Date of Patent: August 13, 2024Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTDInventors: Ying-Qiu Zheng, Chao Peng, Xian-Qin Hu
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Patent number: 12048084Abstract: A covering film (100) includes a first covering layer (10), a first adhesive layer (20), and a thermal conductive layer (30) sandwiched between the first covering layer (10) and the first adhesive layer (20). A thermal conductivity of the thermal conductive layer (30) is K1, K1 is in a range of 3 W/m.K to 65 W/m.K. A thermal conductivity of the first covering layer (10) is K2, K2 is in a range of 0.02 W/m.K to 3.0 W/m.K. A thermal conductivity of the first adhesive layer (20) is K3, K3 is in a range of 0.02 W/m.K to 1.0 W/m.K. A circuit board and its manufacturing method are also provided.Type: GrantFiled: March 27, 2020Date of Patent: July 23, 2024Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTDInventors: Hsiao-Ting Hsu, Ming-Jaan Ho, Katsumi Fujiwara, Fu-Yun Shen, Fu-Wei Zhong
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Patent number: 12004294Abstract: A method of manufacturing a base plate includes the following steps: providing a first substrate, the first substrate including a first base layer, a first copper coating and a second copper coating covered on two sides of the first base layer; opening at least one first hole on the first substrate, the first hole penetrating the first base layer and the first copper; forming a first electroplated coating on the first copper coating, the first copper coating filling the first hole to form a first connecting portion; opening at least one second hole on the first connecting portion and the first electroplated coating to form a plurality of second connecting pins.Type: GrantFiled: May 31, 2022Date of Patent: June 4, 2024Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.Inventor: Zhi Guo
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Patent number: 11991838Abstract: An embedded circuit board made without gas bubbles or significant internal gaps according to a manufacturing method which is here disclosed comprises an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces, a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.Type: GrantFiled: March 31, 2022Date of Patent: May 21, 2024Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.Inventors: Cheng-Yi Yang, Hao-Wen Zhong, Biao Li, Ming-Jaan Ho, Ning Hou
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Patent number: 11979977Abstract: A method for manufacturing a circuit board including: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board having a heat dissipation structure.Type: GrantFiled: August 31, 2019Date of Patent: May 7, 2024Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.Inventors: Hsiao-Ting Hsu, Tao-Ming Liao, Ming-Jaan Ho, Xian-Qin Hu, Fu-Yun Shen
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Patent number: 11977680Abstract: A virtual reality glove includes a gloved shaped substrate including a palm area and a finger area connected with the palm area, a plurality of conductive circuits disposed on the glove shaped substrate, a plurality of tactile feedback units disposed on and electrically connected with the plurality of conductive circuits respectively, and a data processing unit installed on an end of the palm area away from the finger area and electrically connected with the plurality of conductive circuits. The glove shaped substrate is flexible, and the conductive circuits are curved. A method for manufacturing the virtual reality glove is also disclosed.Type: GrantFiled: May 27, 2022Date of Patent: May 7, 2024Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTDInventor: Shi-Jie Zhong
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Patent number: 11968788Abstract: A method for manufacturing a fixing belt for a wearable device, includes providing a flexible circuit board including a first area, a second area, and a pad in the first area; disposing an insulating layer on the flexible circuit board, the insulating layer being disposed in the second area; forming an electric conductive portion in the insulating layer; disposing a first protective layer and a second protective layer on opposite surfaces of the flexible circuit board, the electric conductive portion being between the flexible circuit board and the first protective layer; mounting an electronic component on the pad. A portion of the fixing belt containing the second area is a plug-in area, and the plug-in area is configured to be engaged with a device body of the wearable device, the electric conductive portion is disposed in the plug-in area.Type: GrantFiled: May 28, 2021Date of Patent: April 23, 2024Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, GARUDA TECHNOLOGY CO., LTD.Inventors: Yong-Quan Yang, Han-Pei Huang
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Patent number: 11950357Abstract: A method for manufacturing a circuit board circuit board for transmitting high-frequency signal, including: providing a first-line circuit board (20), a second circuit board (40), at least one third circuit board (50), a fourth circuit board (60), a fifth circuit board (61), and a sixth circuit board (62); stacking the first circuit board (20), the second circuit board (40), and third circuit board (50) in that order, and stacking the fourth circuit board (60), the sixth circuit board (62), and the fifth circuit board (61) on the third circuit board (50), and pressing them together to obtain the circuit board circuit board for transmitting high-frequency signal. The method manufacturing the circuit board circuit board for transmitting high-frequency signal can reduce a width of the transmission line. The present disclosure further provides the circuit board circuit board for transmitting high-frequency signal obtained by the above method.Type: GrantFiled: November 27, 2019Date of Patent: April 2, 2024Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.Inventors: Fu-Yun Shen, Hong-Yan Guo, Hsiao-Ting Hsu, Ming-Jaan Ho