Abstract: A circuit board includes a first outer wiring layer, a circuit substrate, and a second outer wiring layer stacked. The circuit substrate includes a first inner wiring layer, an insulating layer, and a second inner wiring layer stacked. A plurality of thermally conductive pillars is arranged at intervals on the first inner wiring layer, a liquid storage space is formed between every two adjacent thermally conductive pillars, and a thermally conductive agent is received in the liquid storage space. The first outer wiring layer is formed on the plurality of thermally conductive pillars. The second outer wiring layer is formed the second inner wiring layer. A first groove penetrates the second outer wiring layer, the second inner wiring layer and the insulating layer, exposes a portion of the first inner wiring layer, and corresponds to the thermally conductive pillars. At least one heating element is installed in the first groove.

Abstract: A method for manufacturing a circuit board is disclosed. An inner wiring base board with a first opening is provided. A base board is fixed in the first opening, and a first wiring base board and a second wiring base board are pressed on opposite surfaces of the inner wiring base board. The base board is made of ceramic and has a high light reflectivity of 92% to 97%. A first conductor layer and a second conductor layer are formed on opposite surfaces of the laminated structure. The first conductor layer includes a plurality of connecting pads on the base board. A solder mask is formed on an outer side of the first conductor layer, the solder mask has a high light reflectivity of 92% to 95%, and the base board is exposed outside the solder mask.

Abstract: A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.

Abstract: Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.

Abstract: A system for effectively curing dry film ink throughout its thickness on circuit boards being made applies an exposure system, a circuit board, and a method for making the circuit board. The exposure system includes a plurality of mixed light sources with different wavelengths within a range of 365 nm to 440 nm, the mixed light sources can output at least three different wavelengths of light each of substantially a single wavelength and a fourth source of light able to output light of a spectrum of wavelengths, the ranges of light being between 365 nm and 440 nm.

Abstract: A method for manufacturing a circuit board including the following steps: providing a flexible double-sided metal-clad laminate including a first metal foil, a flexible dielectric layer, and a second metal foil. A carrier is attached to the second metal foil. A first wiring layer including a first wiring region and a second wiring region is formed by the first metal foil. The first wiring region includes a first connecting pad, and the second wiring region includes a connecting pad. A plurality of rigid dielectric blocks surrounded to form an interval and a first groove exposing the first connecting pad is pressed on the flexible dielectric layer to form a rigid dielectric layer. An electronic component is fixed the first groove. The carrier is removed. The intermediate structure is bent along the interval and pressed. A second wiring layer is formed by the second metal foil.

Abstract: A method for manufacturing a circuit board includes providing an insulating substrate, defining a through hole in the insulating substrate, forming a first conductive layer on two surfaces of the insulating substrate and on an inner wall of the through hole, forming a phase change material layer on a surface of each first conductive layer, forming a seed layer on a surface of the first conductive layer, forming a second conductive layer on a surface of the seed layer, and etching the seed layer, the first conductive layer, and the second conductive layer, so that a first conductive circuit layer and a second conductive circuit layer are respectively formed on two opposite surfaces of the insulating substrate, so that the phase change material layer is embedded in the first conductive circuit layer and in the second conductive circuit layer. The application also provides a circuit board.

Abstract: A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

Abstract: An antenna module includes an inner circuit board, an antenna circuit board, an outer circuit board, and at least one chip. The inner circuit board includes at least one inner wiring layer and at least one inner dielectric layer. The antenna circuit board includes at least one antenna structure. The antenna circuit board and the outer circuit board are disposed on opposite sides of the inner circuit board. The inner wiring layer comprises at least one inner pad. At least one first opening passing through the outer circuit board is defined to expose the inner pad. Each chip is received in one first opening and electrically connects to the inner pad. The antenna structure electrically connects to the chip through the inner wiring layer. A method for manufacturing such antenna module is also provided.

Abstract: A method for manufacturing a circuit board, includes: stacking a first peelable film on a second peelable film, and disposing fluffy carbon nanotubes between the first peelable film and the second peelable film, thereby obtaining a carbon nanotube layer; pressing the first peelable film, the carbon nanotube layer, and the second peelable film to compact the fluffy carbon nanotubes, thereby obtaining a thermal conductive layer; removing the first peelable film, and disposing a first adhesive layer, a first dielectric layer, and a first circuit layer on a side of the thermal conductive layer away from the second peelable film; removing the second peelable film, and disposing a second adhesive layer, a second dielectric layer, and a second circuit layer on a side of the thermal conductive layer away from the first adhesive layer; mounting an electronic component on the first circuit layer.

Abstract: A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.

Abstract: A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.

Abstract: A circuit board with inbuilt heat dissipating structure includes a stacked structure and the heat dissipation structure. The stacked structure includes first and second copper layers and a cover plate. The embedded heat dissipation structure includes a base body, a thermally conductive adhesive, and a phase changing liquid. The base body penetrates the first copper layer and the first substrate layer, is connected to the second copper layer, and defines grooves. The grooves contain the phase changing liquid. The thermally conductive adhesive seals the ends of the grooves and the cover plate is located on a surface of the stacked structure and covers the thermally conductive adhesive. A method for manufacturing the circuit board is further disclosed.

Abstract: A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.

Abstract: A method for manufacturing a flexible circuit board includes providing a first laminated structure, the first laminated structure including two first wiring boards, a first adhesive layer sandwiched between the two first wiring boards, and a first conductive structure. The first conductive structure penetrates the two first wiring boards and the first adhesive layer and electrically connects the two first wiring boards. The first adhesive layer defines a first opening, the first opening includes a first edge away from the first conductive structure. The first laminated structure is cut along the first edge and then the two first wiring boards are unfolded. A flexible circuit board manufactured by such method is also disclosed.

Abstract: A method for manufacturing a board-to-board connecting structure, including providing a first circuit board, including a first dielectric layer, a second dielectric layer stacked on the first dielectric layer, and a first wiring layer sandwiched between the first dielectric layer and the second dielectric layer. A second circuit board is provided, including a third dielectric layer, a fourth dielectric layers stacked on the third dielectric layer, and a second wiring layer sandwiched between the third dielectric layer and the fourth dielectric layer. The first step and the fourth dielectric layer are bonded through a first adhesive layer. The third step and the dielectric layer are bonded through a second adhesive layer. The second step and the fourth step are bonded through the conductive layer.

Abstract: A flexible battery assembly includes a positive plate, a first filling film, a separator, a second filling film, and a negative plate stacked in order. The positive plate includes a first insulating layer, spaced first current collectors, and a positive electrode active layer. The negative plate includes a second insulating layer, spaced second current collectors, and a negative electrode active layer. Each first current collector corresponds to one second current collector. The first filling film comprises first openings each corresponding to one first current collector, and the first current collectors are embedded in the first openings. The second filling film comprises second openings each corresponding to one second current collector, and the second current collectors are embedded in the second openings. An electrolyte is sealed in the first openings and the second openings. A method for manufacturing such flexible battery assembly is also disclosed.

Abstract: A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

Abstract: A method of manufacturing a base plate includes the following steps: providing a first substrate, the first substrate including a first base layer, a first copper coating and a second copper coating covered on two sides of the first base layer; opening at least one first hole on the first substrate, the first hole penetrating the first base layer and the first copper; forming a first electroplated coating on the first copper coating, the first copper coating filling the first hole to form a first connecting portion; opening at least one second hole on the first connecting portion and the first electroplated coating to form a plurality of second connecting pins.

Abstract: A circuit board includes a multilayer wiring board including a first wiring board and a second wiring board. A receiving cavity penetrates the second wiring board and corresponds to at least one connecting pad of the first wiring board. The receiving cavity includes a receiving portion penetrating the second wiring board and a plurality of recessed portions. Each recessed portion penetrates the second wiring board and is recessed from an inner wall defining the receiving portion. A width of each recessed portion gradually increases from a surface of the second wiring board facing the first wiring board toward a surface of the second wiring board facing away from the first wiring board. An electronic component is received in the receiving cavity and electrically connected to the at least one connecting pad. An adhesive fills in a gap between the electronic component and the second wiring board.