Abstract: A laser module includes an encapsulating support, at least one laser, a sealing gasket, and a pressing plate. Each laser includes a supporting plate and a laser body that is fixed to the supporting plate. The supporting plate is fixed on the encapsulating support, and a surface of an end of the laser body away from the supporting plate is a light exit end face. The sealing gasket is located on a surface of the supporting plate close to the light exit end face, and the sealing gasket has a first opening at a position corresponding to the laser body. A pressing plate is located on a surface of the sealing gasket away from the supporting plate; the pressing plate is fixedly connected to the encapsulating support, and the pressing plate has a second opening at a position corresponding to the first opening.

Abstract: A projector device includes a housing, an optical modulation element provided in the housing, a lens tube with lenses provided inside, and a heat conducting component. A first side wall of the housing is provided with a through hole. The lens tube is nested in the through hole, and a first end of the lens tube is located in the housing and receives lights emitted from the optical modulation element. A first end of the heat conducting component is disposed on an outer wall of a first end of the lens tube, and a second end of the heat conducting component is connected with the housing.

Abstract: A laser array including at least one line of lasers. The at least one line of lasers includes a first laser and a second laser which are adjacent to each other. A first laser beam emitted by the first laser and a second laser beam emitted by the second laser are both in a first color, and the first laser beam has a wavelength less than that of the second laser beam.

Abstract: A projection equipment may including a housing arranged with a first opening and a DMD circuit board arranged with a DMD chip on a side facing the housing, where the DMD chip is arranged with an operational region and a non-operational region. The non-operational region may be located in the periphery of the operational region, and the operational region may modulate a portion of a beam that passes through the first opening when the portion of the beam irradiates onto the operational region. A first heat dissipation member may be arranged between the DMD chip and the housing such that there is a space between the first heat dissipation member and the DMD chip. The first heat dissipation member may be arranged with a second opening which provides a passage for the portion of the beam, while blocking the other portion of the beam.

Abstract: A projector device includes a housing, an optical modulation element provided in the housing, a lens tube with lenses provided inside, and a heat conducting component. A first side wall of the housing is provided with a through hole. The lens tube is nested in the through hole, and a first end of the lens tube is located in the housing and receives lights emitted from the optical modulation element. A first end of the heat conducting component is disposed on an outer wall of a first end of the lens tube, and a second end of the heat conducting component is connected with the housing.

Abstract: A laser array including at least one line of lasers. The at least one line of lasers includes a first laser and a second laser which are adjacent to each other. A first laser beam emitted by the first laser and a second laser beam emitted by the second laser are both in a first color, and the first laser beam has a wavelength less than that of the second laser beam.

Abstract: A wall-hung bracket for a projection screen is provided, including a guide rail, a slider and a lead screw. The guide rail is configured for being fixed on a wall along a vertical direction. The slider is slidingly connected to the guide rail. The slider is configured for being connected to a rear surface of a projection screen. The lead screw is provided with threads, and the lead screw is in threaded connection to the slider. When the lead screw rotates on its longitudinal axis, the slider slides in the vertical direction along the guide rail driven by the lead screw.

Abstract: A laser module includes an encapsulating support, at least one laser, a sealing gasket, and a pressing plate. Each laser includes a supporting plate and a laser body that is fixed to the supporting plate. The supporting plate is fixed on the encapsulating support, and a surface of an end of the laser body away from the supporting plate is a light exit end face. The sealing gasket is located on a surface of the supporting plate close to the light exit end face, and the sealing gasket has a first opening at a position corresponding to the laser body. A pressing plate is located on a surface of the sealing gasket away from the supporting plate; the pressing plate is fixedly connected to the encapsulating support, and the pressing plate has a second opening at a position corresponding to the first opening.

Abstract: A laser array including at least one line of lasers. The at least one line of lasers includes a first laser and a second laser which are adjacent to each other. A first laser beam emitted by the first laser and a second laser beam emitted by the second laser are both in a first color, and the first laser beam has a wavelength less than that of the second laser beam.

Abstract: A method for starting a heat dissipation fan is disclosed, which includes: driving a fan with a first driving voltage and detecting a rotational speed of the fan; and in response to the rotational speed of the fan being zero, switching a driving voltage of the fan to a second driving voltage, where the second driving voltage is greater than the first driving voltage. The present disclosure can improve operating reliability of a fan for a device.

Abstract: A projection equipment may including a housing arranged with a first opening and a DMD circuit board arranged with a DMD chip on a side facing the housing, where the DMD chip is arranged with an operational region and a non-operational region. The non-operational region may be located in the periphery of the operational region, and the operational region may modulate a portion of a beam that passes through the first opening when the portion of the beam irradiates onto the operational region. A first heat dissipation member may be arranged between the DMD chip and the housing such that there is a space between the first heat dissipation member and the DMD chip. The first heat dissipation member may be arranged with a second opening which provides a passage for the portion of the beam, while blocking the other portion of the beam.

Abstract: A laser array including at least one line of lasers. The at least one line of lasers includes a first laser and a second laser which are adjacent to each other. A first laser beam emitted by the first laser and a second laser beam emitted by the second laser are both in a first color, and the first laser beam has a wavelength less than that of the second laser beam.