Abstract: The present invention discloses a laser scribing device that produces optimal scribing lines within a target substrate based on its thickness. This is accomplished by generating multiple or an optimum number of focal points, and dynamically adjusting the focal lengths of the focal points to create optimal distances between the scribing lines. The resulting scribing lines are efficient in breaking the target substrate. The position of the focal points and the distance between them are determined based on the thickness of the target substrate, and the distance between focal points or scribing lines can be dynamically adjusted by modifying the focal lengths of the focal points.
Type:
Grant
Filed:
March 19, 2023
Date of Patent:
April 28, 2026
Assignee:
QMC INC.
Inventors:
Beng So Ryu, Hark Yong Kim, Gwan Yoo Kim, Dong Woo Shin, Seong Ho Song, Jang Hyun Kim