Abstract: Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment a heat transfer system capable of engaging a processor and adapted to transfer heat from the processor is implemented. A variety of embodiments of the heat transfer system are presented. For example, several embodiments of a direct-exposure heat transfer system are presented. In addition, several embodiments of a multi-processor heat transfer systems are presented. Lastly, several embodiments of heat transfer systems deployed in circuit boards are shown. Each of the heat transfer systems is in liquid communication with a heat exchange system that receives heated liquid from the heat transfer system and returns cooled liquid to the heat transfer system.

Abstract: Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system capable of thermally coupling to heat generating components and adapted to transfer heat from the heat generating components is implemented. A variety of embodiments of the heat transfer system are presented. For example, several embodiments of a heat transfer system including electron-conducting material is presented. In one embodiment of the present invention, the electron conducting material operates under the peltier principal.

Abstract: A connector heat transfer unit is presented. A number of embodiments are presented. Each embodiment includes a housing capable electrically connecting one or more heat generating components to an electronic system and cooling the heat generating components.

Abstract: Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system capable of engaging a processor and adapted to transfer heat from the processor is implemented. A variety of embodiments of the heat transfer system are presented. For example, several embodiments of a heat transfer system including electron-conducting material is presented. In one embodiment of the present invention, the electron conducting material operates under the peltier principal.

Abstract: Liquid cooling systems and apparatus and data processing systems and communication systems with liquid cooling systems are presented. A number of embodiments are presented. In each embodiment a plurality of heat transfer systems capable of engaging a plurality heat generating components and each such heat transfer system adapted to transfer heat from the heat generating components is implemented. Each of the heat transfer systems is in liquid communication with a heat exchange system that receives heated liquid from the heat transfer systems and returns cooled liquid to the heat transfer systems. The liquid communication from/to the heat exchange system and the heat transfer systems is in parallel, in series or a combination of parallel and series.

Abstract: A liquid cooling system and apparatus is presented. A two-piece embodiment is presented. The first component is a heat transfer unit capable of engaging a processor and adapted to transfer heat from the processor to a liquid thereby generating heated liquid. The heated liquid is transported through a detachable input and output transport conduit to a second component. The second component is a heat exchange unit capable of cooling the liquid transported from the heat transfer unit. The heat exchange unit includes an input cavity for receiving the heated liquid, a heat dissipater for dissipating heat from the heated liquid thereby producing cooled liquid, and an output cavity for outputting the cooled liquid back to the heat transfer unit. In one embodiment, the heat exchange unit includes a pumping system for pumping the liquid from the heat exchange unit through the conduit to the heat transfer unit and back.