Abstract: A substrate and a method of making thereof are disclosed. The substrate comprises an electrically conductive leadframe, the leadframe having a plurality of lands on a first side of the leadframe with a first recessed portion between the lands, and a plurality of routing leads on an opposing second side of the leadframe with a second recessed portion between the routing leads. The substrate also comprises a first bonding compound filling the first recessed portion. In one embodiment, the substrate also comprises a support material attached to the first bonding compound for holding the leadframe together. In another embodiment, the substrate comprises a second bonding compound filling the second recessed portion.

Abstract: A substrate and a method of making thereof are disclosed. The substrate comprises an electrically conductive leadframe, the leadframe having a plurality of lands on a first side of the leadframe with a first recessed portion between the lands, and a plurality of routing leads on an opposing second side of the leadframe with a second recessed portion between the routing leads. The substrate also comprises a first bonding compound filling the first recessed portion. In one embodiment, the substrate also comprises a support material attached to the first bonding compound for holding the leadframe together. In another embodiment, the substrate comprises a second bonding compound filling the second recessed portion.

Abstract: A substrate for integrated circuit package is disclosed. The substrate comprises an electrically conductive leadframe having a first side and an opposing second side. The substrate has a first bonding compound disposed in a first recessed portion of the first side and a second bonding compound disposed in at least a portion of a second recessed portion of the leadframe, selectively exposing a selected area of the leadframe on the second side. In an exemplary embodiment, the second bonding compound is a photolithographic material. A method of manufacturing a substrate for integrated circuit package is also disclosed.

Abstract: A substrate for integrated circuit package is disclosed. The substrate comprises an electrically conductive leadframe having a first side and an opposing second side. The substrate has a first bonding compound disposed in a first recessed portion of the first side and a second bonding compound disposed in at least a portion of a second recessed portion of the leadframe, selectively exposing a selected area of the leadframe on the second side. In an exemplary embodiment, the second bonding compound is a photolithographic material. A method of manufacturing a substrate for integrated circuit package is also disclosed.

Abstract: An electronic device comprises a leadframe attached to a die and embedded in a mold packaging with enhanced adhesion property. The leadframe comprises a bonding surface, a soldering surface, a mold adhesion surface, and a die attachment surface wherein the soldering surface and bonding surface are selectively plated with nickel/palladium/gold. The mold adhesion surface and the die attachment surface are roughened for better attachment to a mold and a die respectively.

Abstract: A process for enhancing visual detectability of a leadframe having a die attach pad and a plurality of contacts, during automated wirebonding in the production of an integrated circuit package. At least one of a ring, a line and an array of dots are plated on the die attach pad of the leadframe and around a periphery of the die attach pad. The leadframe is surface treated to cause a color change on a surface of the leadframe for improved visual detectability of the at least one of the ring, the line and the dots.

Abstract: A lead frame for used in a surface mount package is provided leads which are each notched at the tip of the lead to reduce the exposed area of based metal and to increase the area on which solder wetting can take place when bonded to conductive traces of a printed circuit board. In one embodiment, the thickness of the tip of the lead is reduced to further the area over which soldering wetting takes place. In that embodiment, the exposed base metal area is reduced by 85 per cent.

Abstract: An aluminium vacuum deposition machine for coating parts of lead frames, having a vacuum chamber containing the lead frames and aluminium to be vaporized. To reduce the incidence of imperfections in the aluminium coatings, a meissner trap is positioned within the vacuum chamber itself rather than or in addition to a meissner trap adjacent to a diffusion pump. Also, to reduce the thermal mass within the chamber, a support jig for the lead frames comprises a pair of end rings and a bracer member joining the end rings and holding them apart. Two pairs of spaced rollers are arranged in the chamber so that each ring rests on a respective pair of rollers, and the rollers are driven so that the support jig is rotated during vacuum deposition.