Abstract: The present invention relates to controls for a multi-zone reflow oven. In the present invention a plurality of infra red thermal scanners are located at critical points along the path which a substrate passes in a reflow oven so as to generate an actual solder paste time/temperature profile as a substrate passes through the zones of the reflow oven. The actual temperature of the solder paste is determined at critical zones for generating feedback control signals. The time/temperature profile is stored for transfer to a different reflow oven so as to effect the identical solder paste time/temperature curve on the same or a different oven.

Abstract: The present invention relates to controls for a multi-zone reflow oven. In the present invention a plurality of infra red thermal scanners are located at critical points along the path which a substrate passes in a reflow oven so as to generate an actual solder paste time/temperature profile as a substrate passes through the zones of the reflow oven. The actual temperature of the solder paste is determined at critical zones for generating feedback control signals. The time/temperature profile is stored for transfer to a different reflow oven so as to effect the identical solder paste time/temperature curve on the same or a different oven.

Abstract: In a pick and place machine of the type having an X-Y movable bond head there is provided a vertically movable pick up tool in the bond head having a tip for picking up and placing a device. The tip of the bonding tool is mounted opposite a radiant heating element which is juxtaposed and separated from the tip of the bonding tool. The tip of the bonding tool is heated to a predetermined control temperature with the radiant energy heating element and during a bonding operation it incurs some cooling. The amount of cooling is calculated by the time and the length of the extension of the bonding tool from its heating element and a computer controller calculates a compensation factor over a predetermined fixed time which includes retracting the bonding tool tip a predetermined vertical distance into the heater to reheat the tool and compensate for the amount of cooling that occurred during the pick and place operation.

Abstract: Apparatus and a method for determining the position of a component held on the end of a pick up tool includes a pick up tool and positioning sensing system mounted on a movable frame with each other. The position sensing system includes an adjustable light source for producing an intense fan of light onto a collimating lens. The collimating lens produces an object field comprising a thin wide sheet of collimated light to be projected on a component held by the pick up tool. The thin wide sheet of light is projected on a component whose position is to be determined and the unblocked rays of light are projected onto an objective focusing lens which focuses the unblocked light through a very small aperture onto a relay lens which receives the refocused unblocked rays of light and produces refocused collimated light rays which are directed as an image onto a linear array sensor having a plurality of high density pixel sensors whose position is known relative to the pick up tool.

Abstract: An end effector or centering chuck is disclosed having centering fingers which employ a linear sliding motion. A stepper motor is mounted on the centering chuck and controls the opening and closing of the centering fingers. The stepper motor is controlled such that the centering fingers decelerate as they approach the work to be centered. The X-axis fingers, for example, are moved into engagement with the work to be centered with the Y-axis fingers disengaged. After alignment in the X direction is achieved, the work is centered in the Y-axis direction with the Y fingers while the X fingers are disengaged.

Abstract: The present invention relates to an apparatus for the automatic assembly of electronic components and, in particular, relates to a programmable substrate transport mechanism for conveying variously sized substrates to a robotic electronic component assembly machine.