Patents Assigned to QUALCOMM Incorpated
  • Patent number: 10542280
    Abstract: A video encoder is configured to determine whether to enable or disable an integer motion vector precision restriction and whether to enable or disable an illumination compensation (IC) tool by: for a large search range in a reference picture, performing first motion estimation tests, wherein performing the first motion estimation tests comprises performing motion estimation tests only with the IC tool disabled and the integer motion vector precision restriction disabled and with the IC tool enabled and the integer motion vector precision restriction disabled; based on the first motion estimation tests, determining a small search range, wherein the small search range is smaller than the large search range; for the small search range, performing second motion estimation tests; and based on the second motion estimation tests, determining whether to enable or disable the integer motion vector precision restriction and whether to enable or disable the IC tool.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: January 21, 2020
    Assignee: QUALCOMM Incorpated
    Inventors: Yu-Chen Sun, Wei-Jung Chien, Li Zhang, Yi-Wen Chen, Nan Hu, Marta Karczewicz
  • Patent number: 9059263
    Abstract: A low-K value dielectric protection spacer for patterning through substrate vias (TSVs) through a low-K value wiring layer. A method for forming a low-K value dielectric protection spacer includes etching a via opening through a low-K value dielectric interconnect layer. A protective layer is deposited in the via opening and on the low-K value dielectric interconnect layer. At least a portion of the protective layer is etched from the bottom of the via opening and from a horizontal surface of the low-K value dielectric interconnect layer. The etching leaving a protective sidewall spacer on a sidewall of the via opening. A through substrate via is etched through the bottom of the via opening and through the semiconductor substrate. The through substrate via is filled with a conductive material.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: June 16, 2015
    Assignee: QUALCOMM Incorpated
    Inventors: Vidhya Ramachandran, Shiqun Gu
  • Publication number: 20140010272
    Abstract: Certain aspects of the present disclosure relate to a technique for pilot based inter-carrier interference (ICI) cancellation in time-varying channel environments, such as wireless mobile broadband systems based on Orthogonal Frequency Division Multiplexing (OFDM).
    Type: Application
    Filed: February 14, 2011
    Publication date: January 9, 2014
    Applicant: QUALCOMM Incorpated
    Inventors: Zhangyong Ma, Neng Wang, Haitong Sun