Patents Assigned to QUALCOMM MEMS
  • Patent number: 9001031
    Abstract: This disclosure provides systems, methods and apparatus for vias in an integrated circuit structure such as a passive device. In one aspect, an integrated passive device includes a first conductive trace and a second conductive trace over the first conductive trace with an interlayer dielectric between a portion of the first conductive trace and the second conductive trace. One or more vias are provided within the interlayer dielectric to provide electrical connection between the first conductive trace and the second conductive trace. A width of the vias is greater than a width of at least one of the conductive traces.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: April 7, 2015
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Chi Shun Lo, Je-Hsiung Jeffrey Lan, Mario Francisco Velez, Robert Paul Mikulka, Chengjie Zuo, Changhan Hobie Yun, Jonghae Kim
  • Publication number: 20150091179
    Abstract: A semiconductor device comprising a second surface of a logic die and a second surface of a via bar coupled to a first surface of a substrate, a second surface of a memory die coupled to a first surface of the via bar, a portion of the second surface of the memory die extending over the first surface of the logic die, such that the logic die and the memory die are vertically staggered, and the memory die electrically coupled to the logic die through the via bar. The via bar can be formed from glass, and include through-glass vias (TGVs) and embedded passives such as resistors, capacitors, and inductors. The semiconductor device can be formed as a single package or a package-on-package structure with the via bar and the memory die encapsulated in a package and the substrate and logic die in another package.
    Type: Application
    Filed: September 27, 2013
    Publication date: April 2, 2015
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Ravindra Vaman SHENOY, Kwan-yu LAI, Jon Bradley LASITER, Philip Jason STEPHANOU, Donald William KIDWELL, JR., Evgeni GOUSEV
  • Patent number: 8995043
    Abstract: This disclosure provides systems, methods and apparatus related to an electromechanical display device. In one aspect, an analog interferometric modulator includes a reflective display pixel having a reflector, and a movable first absorbing layer positionable at a distance d1 from the reflector, the first absorbing layer and the reflector defining a first gap therebetween. The apparatus also includes a second absorbing layer disposed at a distance d2 from the first absorbing layer, the first absorbing layer disposed between the second absorbing layer and the reflector, the second absorbing layer and the first absorbing layer defining a second gap therebetween. In addition, at least two of the reflector, the first absorbing layer and second absorbing layer are movable to synchronously either increase or decrease the thickness dimension of the first gap and the second gap.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: March 31, 2015
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Jian J. Ma, Tallis Y. Chang, John H. Hong
  • Patent number: 8988409
    Abstract: Methods and devices for reducing the voltage required to update an array of display elements having variable capacitance are described herein. In one implementation, the method includes driving a display element to a first state using a reset drive line. The method further includes driving the display element to a second state using a column drive line. The capacitance of the display element is higher in the first state than in the second state.
    Type: Grant
    Filed: July 22, 2011
    Date of Patent: March 24, 2015
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventor: Alok Govil
  • Patent number: 8988440
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for a display with inactive dummy pixels. A display apparatus may include subpixels having a first electrode layer and a second electrode layer. The first electrode layer of an edge subpixel may include an opening, which may be made large enough to prevent the edge subpixel from actuating. The size of the openings also may be selected to attain a desired overall reflectivity for an array of edge subpixels. For example, the size of the openings may be selected to make the reflectivity of an edge pixel array similar to the reflectivity of a routing area.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: March 24, 2015
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Koorosh Aflatooni, Farnaz Parhami, Suryaprakash Ganti
  • Patent number: 8988760
    Abstract: Encapsulation is provided to electromechanical devices to protect the devices from such environmental hazards as moisture and mechanical shock. In addition to the encapsulation layer providing protection from environmental hazards, the encapsulation layer is additionally planarized so as to function as a substrate for additional circuit elements formed above the encapsulation layer.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: March 24, 2015
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventor: Je-Hsiung Lan
  • Patent number: 8979349
    Abstract: Illumination devices and methods of making same are disclosed. In one embodiment, an illumination apparatus includes a light source, a light guide having a planar first surface, a first end and a second end, and a length therebetween, the light guide positioned to receive light from the light source into the light guide first end, and the light guide configured such that light from the light source provided into the first end of the light guide propagates towards the second end, and a plurality of light turning features that are configured to reflect light propagating towards the second end of the light guide out of the planar first surface of the light guide, each light turning feature having a turning surface and an interferometric stack formed on the turning surface.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: March 17, 2015
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Ion Bita, Sapna Patel, Clayton Ka Tsun Chan, SuryaPrakash Ganti, Brian W. Arbuckle
  • Patent number: 8979347
    Abstract: This disclosure provides systems, methods, and apparatus for providing illumination for lighting systems. One or more light emitters can be disposed about a longitudinal axis, such as in an at least partial polygonal shape, so that the light sources emit light radially outwardly away from the longitudinal axis. A collimating reflector can be disposed radially outward of the one or more light emitters and can be configured to at least partially collimate the light and to substantially preserve etendue of the light emitted from the light emitters. The one or more light emitters can substantially fill an input aperture of the collimating reflector in a direction of the longitudinal axis. The light can be coupled into a light guide, which can be configured to distribute the light to a target lighting area.
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: March 17, 2015
    Assignee: Qualcomm MEMS Technologies, Inc.
    Inventor: Robert L. Holman
  • Publication number: 20150070320
    Abstract: An optical touch sensor may include traces of photoconductive material formed on a substantially transparent substrate. Each photoconductive trace may be capable of responding to an incident light intensity increase on a portion of the photoconductive trace by increasing the number of charged carriers, thereby raising the electrical conductivity of that portion of the photoconductive trace. An incident light intensity decrease on a portion of the photoconductive trace will lower the electrical conductivity of that portion of the photoconductive trace. The corresponding changes in voltage may be measured by circuits that include conductive traces formed substantially perpendicular to, and configured for electrical connection with, the traces of photoconductive material. A diode (such as a Schottky diode) may be formed at the electrical connections between the conductive traces and the photoconductive traces.
    Type: Application
    Filed: November 22, 2013
    Publication date: March 12, 2015
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: John Hyunchul Hong, Jian J. Ma, Bing Wen, Cheonhong Kim
  • Publication number: 20150070750
    Abstract: Some implementations described herein involve defining a viewing angle range, also referred to herein as a viewing cone. The viewing cone may be produced by an array of optical fibers on a display. The optical fiber array may include tapered optical fibers that are capable of increasing the amount of light transmitted through the optical fiber array. The optical fiber array may be a graded index optical fiber array, wherein the refractive index of the optical fiber cores varies along the axis of the optical fibers.
    Type: Application
    Filed: October 17, 2013
    Publication date: March 12, 2015
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: John H. Hong, Jian J. Ma, Bing Wen, Tallis Y. Chang
  • Publication number: 20150070747
    Abstract: This disclosure provides circuits and methods for resetting a movable element, such as a mirror of an interferometric modulator (IMOD), to a consistent starting point or reset position. In one example, a circuit may include three electrodes with a capacitor coupled between two of the electrodes. Additionally, the polarity of one of the electrodes may be configured to switch and reverse in polarity relative to another electrode. Accordingly, the movable element may be moved to a reset position.
    Type: Application
    Filed: September 9, 2013
    Publication date: March 12, 2015
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Edward Keat Leem Chan, Cheonhong Kim, Wilhelmus Johannes R. Van Lier, Bing Wen, Chandra Shekar Reddy Tupelly, Ningning Zhou, Richard Yeh
  • Publication number: 20150067017
    Abstract: Methods and systems may facilitate access to media. A mobile computing device may manage media associated with links by evaluating factors that may affect battery life. The mobile computing device may obtain information about the media associated with the links, such as metadata indicating file characteristics, identifying information, and analytics. The information may be included in the media or obtained from a server. The mobile computing device may evaluate factors that affect the device's ability to receive and render the media. Such factors may include the battery charge state, signal strength, connectivity, or media characteristics (e.g., size, complexity, etc.). The mobile computing device may prioritize the links associated with the media based on the evaluation of the factors, such as by sorting the links by rank. The mobile computing device may also hide links, display warnings/indicators, display links in particular manners or formats, and automatically download the media.
    Type: Application
    Filed: August 30, 2013
    Publication date: March 5, 2015
    Applicant: QUALCOMM MEMS Techologies, Inc.
    Inventors: Hemang Jayant SHAH, Siddharth KHIMSARA, Babak FORUTANPOUR, Shriram GANESH
  • Patent number: 8971675
    Abstract: An interferometric modulator array is formed with connectors and/or an encapsulation layer with electrical connections. The encapsulation layer hermetically seals the array. Circuitry may also be formed over the array.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: March 3, 2015
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventor: Jon Bradley Lasiter
  • Patent number: 8970939
    Abstract: A multi-state light modulator comprises a first reflector. A first electrode is positioned at a distance from the first reflector. A second reflector is positioned between the first reflector and the first electrode. The second reflector is movable between an undriven position, a first driven position, and a second driven position, each having a corresponding distance from the first reflector. In one embodiment, the three positions correspond to reflecting white light, being non-reflective, and reflecting a selected color of light. Another embodiment is a method of making the light modulator. Another embodiment is a display including the light modulator.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: March 3, 2015
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Clarence Chui, William J. Cummings, Brian J. Gally
  • Patent number: 8970941
    Abstract: This disclosure provides systems, methods and apparatus related to an electromechanical display device. In one aspect, an analog interferometric modulator (AIMOD) includes a reflective display pixel having a movable reflective layer and a stationary absorber layer, the reflective layer and absorber layer defining a cavity therebetween. A color notch filter may be employed to produce an improved white state. In some implementations, the color notch filter is positioned on a side of the substrate opposite the absorber layer. In some other implementations, the color notch filter is positioned between the substrate and the movable reflective layer.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: March 3, 2015
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Jian Ma, Tallis Young Chang, John Hyunchul Hong, Ion Bita
  • Patent number: 8970516
    Abstract: This disclosure provides systems, methods and apparatus for combining devices deposited on a first substrate, with integrated circuits formed on a second substrate such as a semiconducting substrate or a glass substrate. The first substrate may be a glass substrate. The first substrate may include conductive vias. A power combiner circuit may be deposited on a first side of the first substrate. The power combiner circuit may include passive devices deposited on at least the first side of the first substrate. The integrated circuit may include a power amplifier circuit disposed on and configured for electrical connection with the power combiner circuit, to form a power amplification system. The conductive vias may include thermal vias configured for conducting heat from the power amplification system and/or interconnect vias configured for electrical connection between the power amplification system and a conductor on a second side of the first substrate.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: March 3, 2015
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Justin Phelps Black, Ravindra V. Shenoy, Evgeni Petrovich Gousev, Aristotele Hadjichristos, Thomas Andrew Myers, Jonghae Kim, Mario Francisco Velez, Je-Hsiung Jeffrey Lan, Chi Shun Lo
  • Patent number: 8970767
    Abstract: This disclosure provides systems, methods and apparatus for an imaging system that includes a light guide having light-turning features that are configured to receive ambient light incident on the light guide, including light scattered from a scene to be imaged, and to direct the received ambient light towards an image sensor. The light-turning features may have angle-discriminating properties so that some light-turning features capture light incident upon the light guide at certain angles of incidence, but not others. Light scattered from multiple parts of a scene to be imaged may then be directed to correlated locations on an image sensor, which provides electronic data representing an image.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: March 3, 2015
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Russell Wayne Gruhlke, Ye Yin, Zheng-wu Li
  • Patent number: 8964280
    Abstract: Methods and apparatus are provided for controlling a depth of a cavity between two layers of a light modulating device. A method of making a light modulating device includes providing a substrate, forming a sacrificial layer over at least a portion of the substrate, forming a reflective layer over at least a portion of the sacrificial layer, and forming one or more flexure controllers over the substrate, the flexure controllers configured so as to operably support the reflective layer and to form cavities, upon removal of the sacrificial layer, of a depth measurably different than the thickness of the sacrificial layer, wherein the depth is measured perpendicular to the substrate.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: February 24, 2015
    Assignee: Qualcomm MEMS Technologies, Inc.
    Inventors: Ming-Hau Tung, Lior Kogut
  • Patent number: 8963159
    Abstract: This disclosure provides systems, methods and apparatuses for pixel vias. In one aspect, a method of forming an electromechanical device having a plurality of pixels includes depositing an electrically conductive black mask on a substrate at each of four corners of each pixel, depositing a dielectric layer over the black mask, depositing an optical stack including a stationary electrode over the dielectric layer, depositing a mechanical layer over the optical stack, and anchoring the mechanical layer over the optical stack at each corner of each pixel. The method further includes providing a conductive via in a first pixel of the plurality of pixels, the via in the dielectric layer electrically connecting the stationary electrode to the black mask, the via disposed at a corner of the first pixel, offset from where the mechanical layer is anchored over the optical stack in an optically non-active area of the first pixel.
    Type: Grant
    Filed: April 4, 2011
    Date of Patent: February 24, 2015
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Hojin Lee, Fan Zhong, Yi Tao
  • Publication number: 20150048514
    Abstract: This disclosure provides systems, methods and apparatus for a stacked via having a top via structure and a bottom via structure. In one aspect, the bottom via structure includes a bottom dielectric layer and a bottom via extending through the bottom dielectric layer. The bottom via includes a bottom metal formed on the bottom dielectric layer, where the bottom via is substantially filled by a dielectric material. The top via structure includes a top dielectric layer over the bottom metal and a top via extending to a top plane of the bottom via in the top dielectric layer. The top via includes a top metal formed on the top dielectric layer, where the top metal is in electrical contact with the bottom metal at a peripheral area of the bottom via structure.
    Type: Application
    Filed: August 14, 2013
    Publication date: February 19, 2015
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Hairong Tang, Yaoling Pan, Tsengyou Syau