Patents Assigned to Qualitek International, Inc.
  • Soldering composition
    Patent number: 5435857
    Abstract: A soldering composition consisting essentially of an alloy comprising tin, indium, antimony, silver and in the range of 0.0% to about 10.5% by weight bismuth.
    Type: Grant
    Filed: January 6, 1994
    Date of Patent: July 25, 1995
    Assignee: Qualitek International, Inc.
    Inventors: Tippy H. Han, Phodi Han