Patents Assigned to Quality Packing, Inc.
  • Recyclable Blister Pack and Process of Making
    Publication number: 20090101534
    Abstract: A recyclable blister pack system is provided, including a substrate having a dry tack cohesive adhesive layer deposited on one of its surfaces and a blister layer for receiving a product. The properties of the dry tack cohesive are selected so the blister layer is separable from the substrate without leaving substantial substrate residue on the blister layer. This improves the recyclability of the blister layer.
    Type: Application
    Filed: October 16, 2008
    Publication date: April 23, 2009
    Applicant: Quality Packing, Inc.
    Inventor: Kenneth Raymond Wills