Patents Assigned to Quality Platers Limited
  • Leadframe for enhanced downbond registration during automatic wire bond process
    Patent number: 6667073
    Abstract: A process for enhancing visual detectability of a leadframe having a die attach pad and a plurality of contacts, during automated wirebonding in the production of an integrated circuit package. At least one of a ring, a line and an array of dots are plated on the die attach pad of the leadframe and around a periphery of the die attach pad. The leadframe is surface treated to cause a color change on a surface of the leadframe for improved visual detectability of the at least one of the ring, the line and the dots.
    Type: Grant
    Filed: May 7, 2002
    Date of Patent: December 23, 2003
    Assignee: Quality Platers Limited
    Inventors: Yung Piu Lau, Mohamed Lebbai Moosa Naina