Patents Assigned to Quality Semiconductor Inc.
  • Patent number: 5311475
    Abstract: A read signal and write signal for a FIFO each has a flag generating edge and a preceding edge. The read or write counter in an empty of full flag generator responds to the preceding edge of the read or write signal so that the empty or full comparator of the generator may generate an updated empty or full flag value before the onset of the flag generating edge. The empty or full flag generator also includes a gate and a pulse generating circuit. The pulse generating circuit responds to the flag generating edge by generating an enabling signal enabling the gate to pass the comparator output to a latch. When the empty or full comparator indicates that a FIFO is empty or full, the comparator output passed by the gate will force the output high, thereby asserting an empty flag or a full flag. The empty flag generator also includes a second pulse generating circuit which updates the empty flag signal to indicate a non-empty FIFO in response to each write signal.
    Type: Grant
    Filed: April 26, 1991
    Date of Patent: May 10, 1994
    Assignee: Quality Semiconductor Inc.
    Inventor: Samson X. Huang
  • Patent number: 5254874
    Abstract: A metal silicide layer in or on a body of silicon wafer is used for interconnecting two or more CMOS circuit devices. In addition to a polysilicon layer and a metal layer, the metal silicide layer provides an additional layer of local interconnect which can be performed at high density to reduce the size of the die while including the same number of circuit devices. An amorphous silicon layer doped at selected regions may be used as an additional interconnect.
    Type: Grant
    Filed: October 8, 1991
    Date of Patent: October 19, 1993
    Assignee: Quality Semiconductor Inc.
    Inventor: Manohar L. Malwah
  • Patent number: 5228002
    Abstract: To reduce the access time of a FIFO, a storage device is provided for storing pre-loaded data to be read from the memory array of the FIFO. Thus during each read operation, the pre-loaded data in the storage device is read and the next unit of data to be read during the next read operation is pre-loaded from the array into the storage device. A second storage device is provided for storing the first unit of data written into the array after the array is empty. Thus during the first read operation after the array is rendered non-empty by one or more consecutive write operations, the first unit of data stored in the second storage device is read during the first read operation. This avoids reading garbage from the first storage device which is pre-loaded during the last read operation before the FIFO is empty.
    Type: Grant
    Filed: April 26, 1991
    Date of Patent: July 13, 1993
    Assignee: Quality Semiconductor Inc.
    Inventor: Samson X. Huang
  • Patent number: 5223456
    Abstract: A metal silicide layer in or on a body of silicon wafer is used for interconnecting two or more CMOS circuit devices. In addition to a polysilicon layer and a metal layer, the metal silicide layer provides an additional layer of local interconnect which can be performed at high density to reduce the size of the die while including the same number of circuit devices. An amorphous silicon layer doped at selected regions may be used as an additional interconnect.
    Type: Grant
    Filed: September 15, 1992
    Date of Patent: June 29, 1993
    Assignee: Quality Semiconductor Inc.
    Inventor: Manohar L. Malwah