Abstract: A MEMS BAW vibratory planar gyroscope having an in-plane electrode configuration for mode-alignment by utilizing alignment electrodes that have a height less than a full height of the gyroscope resonant body. Such alignment electrodes apply a force component that affects modes with both in-plane and out-of-plane movements. The gyroscope includes a resonant body having a height and a perimeter surface and electrodes disposed adjacent the exterior perimeter surface of the resonant body. At least one of the electrodes is an alignment electrode and has a height less than the height of the resonant body.

Abstract: An charge pump architecture capable of generating ultra high DC voltages but implemented in low voltage CMOS technology uses a cascade of NMOS stages with the bulk terminal of the latter stages biased to a voltage just below the reverse breakdown of the parasitic bulk diode. The bias voltage is tapped from a lower voltage point within the charge pump. The upper limit of the output voltage is then increased to the maximum allowable oxide voltage plus the parasitic diode reverse bias breakdown voltage.

Abstract: The present disclosure provides a varying high voltage source implemented with low voltage domain electronic components that are less costly to manufacture. According to one aspect, the present disclosure provides a high voltage circuit apparatus comprising a pull up resistance module, a plurality of cascode cell stages, a first of the cascode cell stages being coupled to the pull up resistance module, a low voltage domain current sink module coupled to a last of the cascode cell stages, and a clamping voltage source coupled to the last of the cascode cell stages. The circuit apparatus is devoid of high-voltage transistor components.

Abstract: Disclosed is an isolation mechanism and technique for packaging a MEMS transducer, such as a bulk acoustic wave gyroscope or accelerometer, to provide isolation from externally applied (or internally induced) stress, strain, vibration, shock and thermal transients. The disclosed methods and techniques enable the location of voids/air cavity/environmental isolations inside an encapsulant or over mold compound to be custom selected by treating at least a portion of the exterior surfaces of the MEMS device package with anti-stiction coatings to create opposing hydrophobic and hydrophilic conditions which during encapsulant and transfer molding steps create voids or air bubbles in the proximity of the anti-stiction coating due to the opposing water resistive characteristic of encapsulant.

Abstract: A microelectromechanical (MEMS) package including a compressive system preferentially directs external forces, towards the MEMS sensor in a manner that affects several components of the Quality Factor (Q) of the MEMS system. Relatively rigid materials (force transfer elements) are added or deposited in strategic places along any of the edges, faces or corners of a MEMS sensor, followed by the addition of material, which by virtue of the annealing process, applies a compressive stress to all objects encased therein. As a result, vibrational modes are affected due to changes in the effective mass and spring constants of the total MEMS apparatus system, dampening particular modes and stabilizing the MEMS transducer since such modes cannot be spuriously activated due to environmental changes. By attenuating, or at least causing them to be constant, the spurious modes and their absorption of vibrational energy are predictable over all operating conditions and thus amenable to electronic controls, e.g.

Abstract: A pedestal projection having reduced cross-sectional area secures a MEMs device to a housing surface in a manner which reduces strain on the MEMS die due to differences in coefficients of thermal expansion while more evenly distributing to the MEMS sensor any external forces mechanically coupled through the housing structure. The pedestal projection may be integrally formed with a surface on either MEMS die or housing member and is axially aligned with the structure which anchors the MEMS sensor to the MEMS die.

Abstract: An isolation mechanism and technique for packaging a MEMS transducer, such as a bulk acoustic wave gyroscope or accelerometer, which allows rotational information to be sensed by the transducer while providing the necessary isolation from externally applied (or internally induced) stress, strain, vibration, shock and thermal transients. The isolation mechanism is constructed of interposing materials that may be implemented with elastomeric-strain-absorbing-materials (ESAM) layers having different elastic moduli, with the most compliant ESAM layer disposed closest to the MEMS transduce. In another embodiment, one or more ESAM layers may have air pockets dispersed therein. The isolation mechanism enables mechanical, thermal and vibrational isolation of the MEMS transducer from the package substrate, while still permitting electrical continuity between the MEMS device and the external environment.

Abstract: MEMS accelerometers have a substrate, and a proof mass portion thereof which is separated from the substrate surrounding it by a gap. An electrically-conductive anchor is coupled to the proof mass, and a plurality of electrically-conductive suspension anus that are separated from the proof mass extend from the anchor and are coupled to the substrate surrounding the proof mass. A plurality of sense and actuation electrodes are separated from the proof mass by gaps and are coupled to processing electronics. The fabrication methods use deep reactive ion etch bulk micromachining and surface micromachining to form the proof mass, suspension arms and electrodes. The anchor, suspension arms and electrodes are made in the same process steps from the same electrically conductive material, which is different from the substrate material.

Abstract: Disclosed are MEMS accelerometers and methods for fabricating same. An exemplary accelerometer comprises a substrate, and a proof mass that is a portion of the substrate and which is separated from the substrate surrounding it by a gap. An electrically-conductive anchor is coupled to the proof mass, and a plurality of electrically-conductive suspension anus that are separated from the proof mass extend from the anchor and are coupled to the substrate surrounding the proof mass. A plurality of sense and actuation electrodes are separated from the proof mass by gaps and are coupled to processing electronics. Capacitive sensing is used to derive electrical signals caused by forces exerted on the proof mass, and the electrical signals are processed by the processing electronics to produce x-, y- and z-direction acceleration data. Electrostatic actuation is used to induce movements of the mass for force balance operation, or self-test and self-calibration.

Abstract: Disclosed are MEMS accelerometers and methods for fabricating same. An exemplary accelerometer comprises a substrate, and a proof mass that is a portion of the substrate and which is separated from the substrate surrounding it by a gap. An electrically-conductive anchor is coupled to the proof mass, and a plurality of electrically-conductive suspension anus that are separated from the proof mass extend from the anchor and are coupled to the substrate surrounding the proof mass. A plurality of sense and actuation electrodes are separated from the proof mass by gaps and are coupled to processing electronics. Capacitive sensing is used to derive electrical signals caused by forces exerted on the proof mass, and the electrical signals are processed by the processing electronics to produce x-, y- and z-direction acceleration data. Electrostatic actuation is used to induce movements of the mass for force balance operation, or self-test and self-calibration.

Abstract: Disclosed are MEMS accelerometers and methods for fabricating same. An exemplary accelerometer comprises a substrate, and a proof mass that is a portion of the substrate and which is separated from the substrate surrounding it by a gap. An electrically-conductive anchor is coupled to the proof mass, and a plurality of electrically-conductive suspension anus that are separated from the proof mass extend from the anchor and are coupled to the substrate surrounding the proof mass. A plurality of sense and actuation electrodes are separated from the proof mass by gaps and are coupled to processing electronics. Capacitive sensing is used to derive electrical signals caused by forces exerted on the proof mass, and the electrical signals are processed by the processing electronics to produce x-, y- and z-direction acceleration data. Electrostatic actuation is used to induce movements of the mass for force balance operation, or self-test and self-calibration.

Abstract: Disclosed are MEMS accelerometers and methods for fabricating same. An exemplary accelerometer comprises a substrate, and a proof mass that is a portion of the substrate and which is separated from the substrate surrounding it by a gap. An electrically-conductive anchor is coupled to the proof mass, and a plurality of electrically-conductive suspension arms that are separated from the proof mass extend from the anchor and are coupled to the substrate surrounding the proof mass. A plurality of sense and actuation electrodes are separated from the proof mass by gaps and are coupled to processing electronics. Capacitive sensing is used to derive electrical signals caused by forces exerted on the proof mass, and the electrical signals are processed by the processing electronics to produce x-, y- and z-direction acceleration data. Electrostatic actuation is used to induce movements of the mass for force balance operation, or self-test and self-calibration.