Abstract: Dynamic Digital Modulation obtains thermal image data on active semiconductor devices with sufficient sensitivity to be used in situ with packaged devices. These techniques can be applied to dynamic failures, but can also produce quantitative data of actual power dissipation as the device is placed into different operational modes. The thermal image results can be analyzed to assist in thermal management and assessing reliability and failure analysis issues in semiconductor devices.

Abstract: Dynamic Digital Modulation obtains thermal image data on active semiconductor devices with sufficient sensitivity to be used in situ with packaged devices. These techniques can be applied to dynamic failures, but can also produce quantitative data of actual power dissipation as the device is placed into different operational modes. The thermal image results can be analyzed to assist in thermal management and assessing reliability and failure analysis issues in semiconductor devices.

Abstract: Methods and apparatus for producing sub-diffraction limited images utilizing an exponential scaling effect. An exemplary system provides an optical source that focuses an optical beam onto a target. The focused optical beam has sufficient optical intensity to induce an exponential signal response within the target. A detection device detects the exponential signal response. A scanning device scans the focused optical source and another device records the detection of the exponential signal response for purposes of producing a sub-diffraction limited image. The system further includes a display device that displays at least a portion of the recorded detection.

Abstract: An apparatus for analyzing an integrated circuit to which one or more test signals are applied. An example apparatus includes an objective lens that views reflections from the integrated circuit, a device that houses at least two optical fibers, a component that receives reflections from the objective lens and directs the received reflections to the device, and a photo-diode that receives a reflection received by the device. The apparatus includes a beam splitter that directs reflections from the integrated circuit to a detector. A processing device generates an image signal based on a signal received from the detector and a display outputs an image based on the image signal. The component includes a scan mirror that reflects the collimated reflections to a collimating lens that focuses the reflections from the scan mirror toward the device.