Abstract: In accordance with the present invention, there are provided adhesive formulations containing small amounts of bleed control agent, which render the invention compositions extremely resistant to resin bleed. Several different types of bleed control agents are contemplated for use in the practice of the present invention, e.g., cationic surfactants, tertiary amines, tertiary phosphines, amphoteric surfactants, polyfunctional compounds, and the like, as well as mixtures of any two or more thereof.

Abstract: In accordance with the present invention, there are provided adhesive formulations containing small amounts of bleed control agent, which render the invention compositions extremely resistant to resin bleed. Several different types of bleed control agents are contemplated for use in the practice of the present invention, e.g., cationic surfactants, tertiary amines, tertiary phosphines, amphoteric surfactants, polyfunctional compounds, and the like, as well as mixtures of any two or more thereof.

Abstract: In accordance with the present invention, it has been discovered that perfluorinated hydrocarbon polymers can be used as fillers for the preparation of adhesive formulations having excellent dielectric properties, i.e., very low conductivities. Invention compositions display excellent rheological properties, in addition to low dielectric constants. Invention formulations can be used for a variety of purposes, such as, for example, for the preparation of filled adhesive formulations with a reduced propensity to settle out, excellent dispensing characteristics due to the thixotropic nature thereof, and the like.

Abstract: In accordance with the present invention, there are provided novel propargyl ether-based compositions that are very effective when used in underfill applications. Aromatic propargyl ether compounds are believed to represent the most robust resin chemistry currently available to meet the many performance requirements associated with underfill applications. Propargyl ether resins are hydrophobic, hydrolytically stable, low toxicity monomers that can be cured to high T.sub.g, thermally stable thermosets. Liquid propargyl ether monomers have been found and/or described in the literature which can be used alone or in combination to yield diluent free underfill compositions. Alternatively, mixtures of two or more propargyl ether monomers (wherein one or more of these monomers may be solids at room temperature) can be used to create diluent-free, room temperature stable, eutectic or peritectic liquid resin compositions.

Abstract: A metal/glass paste composition with a high metal to glass ratio and a method of using the paste to adhesively connect an integrated circuit to a ceramic substrate. The glass composition consists essentially of, by weight percent on an oxide basis:about 40-65% Ag.sub.2 Oabout 15-35% V.sub.2 O.sub.5about 0-30% PbO.sub.2about 0-20% TeO.sub.2The essentially resin-free paste utilizes the glass composition described above and, for a metallized ceramic substrate, has a metal:glass ratio of from about 8:1 up to about 11.5:1. For a bare (nonmetallized) ceramic substrate, the paste has a metal:glass ratio of from about 8:1 up to about 32:1.

Abstract: In accordance with the present invention, there are provided adhesive formulations containing small amounts of bleed control agent, which render the invention compositions extremely resistant to resin bleed. Several different types of bleed control agents are contemplated for use in the practice of the present invention, e.g., cationic surfactants, tertiary amines, tertiary phosphines, amphoteric surfactants, polyfunctional compounds, and the like, as well as mixtures of any two or more thereof.

Abstract: A glass composition and method of use having unique crystallization and crystal remelt properties is disclosed. The glass composition consists essentially by weight percent on an oxide basis:about 40-65% Ag.sub.2 Oabout 15-35% V.sub.2 O.sub.5about 0-30% PbO.sub.2about 0-20% TeO.sub.2The present invention also contemplates a unique, essentially resin-free organic system that utilizes the novel glass composition described above and has a ratio of silver to glass (solids) of from about 3 to 1 to about 8 to 1.

Abstract: An alternative vehicle system which utilizes no resin for depositing an inorganic material onto a substrate. The vehicle system consists of mixtures of solvents having high intrinsic viscosity and good wetability providing a pseudoplastic rheology.

Abstract: In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer, electrically conductive filler rendered substantially free of catalytically active metal ions and a curing catalyst. Treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.

Abstract: A manually operable apparatus for selectively assembling chips to substrates comprises a support base having a first support for supporting a substrate preparatory to attachment of a chip thereto, second support for supporting a chip preparatory to selection for attachment to a substrate, a manually operable swing arm assembly mounted on the support base and having a first arm for placement of an adhesive paste to a surface of a substrate on the first support and a second arm for selecting and placing a chip on the substrate.

Abstract: A connector assembly for connecting to a chip and a substrate for testing the bond between a chip and a substrate in a testing apparatus, the connector assembly comprises a pair of connector blocks, each block having a generally square planar connecting face for bonding to oppositely directed faces of a chip and substrate, and a coupling end for mounting in a tensile testing machine, and a swivel connector assembly for connecting to the coupling and mounting in a tensile testing machine for the application of aligned tension to the chip and substrate.

Abstract: An alternative vehicle system which utilizes no resin for depositing an inorganic material onto a substrate. The vehicle system consists of mixtures of solvents having high intrinsic viscosity and good wetability providing a pseudoplastic rheology.

Abstract: An adhesive bonding composition with bond line limiting spacer system includes an adhesive paste composition having a hardenable adhesive component, and a plurality of spacer elements distributed in the adhesive paste composition. The spacer elements are sized to provide a self-limiting bond line thickness between the surfaces to be bonded, the bond line thickness being maintained at a selected lower limit by the spacer elements.

Abstract: Improved soldering paste for surface mounting of electronic components comprises a novel fluxing agent selected from formylated polyhydric compounds. The paste enables circuit boards to be washed with water to remove flux residues.

Abstract: Improved soldering paste for the surface mounting of electronic components comprises a novel fluxing agent selected from quaternary ammonium hydroxides and mixtures thereof. Use of these agents as fluxes eliminates the problem of ionic residues on circuit boards and permits the boards to be washed with water to remove any non-ionic residues.

Abstract: Glass frit and silver particles are combined with a vehicle gel comprising a cross-linked resin dispersed in an organic solvent. The resin comprises a polymerized monomer selected from a first group consisting of C.sub.1 to C.sub.4 alkyl methacrylates and mixtures thereof and from a second group consisting of glycol dimethacrylates and mixtures thereof. The paste may consist of 60 to 80 weight percent silver particles, 12 to 20 weight percent glass frit and 8 to 20 weight percent vehicle gel. The resin content of the vehicle gel may be one to ten weight percent.

Abstract: A silver glass paste consists of 60-75% silver flake having a tap density greater than 2.8 gm/cc and less than 5.0 gm/cc. The silver flake has a poly-modal flake size distribution. The paste further consists of 12-20% glass frit, 0.5-2% of a suitable organic resin and 8-20% of a suitable organic solvent. The resin may be acrylic and the organic solvent may be an ester alcohol or an ester alcohol mixed with a glycol ether or glycol ether ester.

Abstract: Silver flake and lead borate glass frit are suspended in a liquid organic vehicle of resin and solvent. The silver flakes are present in two different size ranges. The plate is applied between the silicon die and the substrate and is oven fired to provide a bond that accommodates the different coefficients of thermal expansion of the silicon and ceramic substrate. The smaller silver particles improve the sintering of the silver and glass and thereby increase the bond strength while the larger silver particles minimize undersirable shrinkage and cracking of the resultant bond. Silver oxide particles or a special solvent mixture are also used in the paste.