Abstract: An optical transmission device is provided. A substrate includes an optical transmission channel exposed on its end surface, and a first positioning portion. A jumper includes a mounting portion abutting the end surface and a second positioning portion engaged to the first positioning portion. An optical fiber is mounted to the mounting portion, and the end surface of the optical fiber aligns with the optical transmission channel. The coupling method of the optical transmission device includes steps: forming at least one first hole on the substrate, forming an optical transmission layer with at least one optical transmission channel on the substrate, forming an alignment mark on the optical transmission layer within the first hole, forming at least one second hole on the substrate based on the alignment mark, and connecting the jumper to the second hole and make the jumper abutting against the substrate.

Abstract: A high-frequency connector assembly includes a plurality of connection terminal groups, at least one first metal part, a plurality of second metal parts and an insulating shell. Each connection terminal group includes a male terminal and a female terminal, the male terminal is in contact with the female terminal to transmit signals, and the connection terminal groups are arranged along a first direction; the at least one first metal part extends along the first direction; the second metal parts are disposed between the plurality of connection terminal groups and extend along a second direction, in which each second metal part includes at least two metal pieces, and the at least two metal pieces are not connected to each other; the insulating shell carries the second metal parts, so that the at least one first metal part and the second metal parts are not in contact with each other.

Abstract: An electric device and a method for utilizing millimeter wave communication and radar sensing are provided. The electric device includes an antenna module, a millimeter wave communication module, a radar sensing module and a control module. The millimeter wave communication module and the radar sensing module share a sine-wave generator circuit, a frequency upconverter and a frequency downconverter, and respectively perform a millimeter wave communication operation and a radar sensing operation in accordance with an operation indicator signal transmitted by the control module. The method includes: using an operation indicator signal transmitted by a control module to control a millimeter wave communication module and a radar sensing module to perform a millimeter wave communication operation and a radar sensing operation in a predetermined work period.

Abstract: A 24 GHz band-pass filter includes a step impedance resonator, a first U-shape feeding portion, a second U-shape feeding portion, short-circuit stubs and open-circuit stubs. The step impedance resonator includes a first main portion, a second main portion, and a connection portion for connecting the main portions to each other. The first main portion and the second main portion are electrically connected to a first signal input/output port and a second signal input/output port. The first U-shape feeding portion is electrically connected between the first main portion and the first signal input/output port. The second U-shape feeding portion is electrically connected between the second main portion and the second signal input/output port. The short-circuit stubs are electrically connected to coupling segments of the step impedance resonator. The open-circuit stubs are electrically connected to the first U-shape feeding portion and the second U-shape feeding portion.

Abstract: A Balun filter is disposed on a circuit board, and includes a first wire, a second wire, a third wire and a ground plane. The first wire has one end for disposing a first feeding point. The second wire has one end for disposing a second feeding point. The third wire is configured for disposing a third feeding point and includes a first coupling section, a second coupling section, a first central section and a second central section. The third feeding point is located between the first central section and the second central section, and the first coupling section, the first central section, the second central section and the second coupling section are electrically connected in sequence. In a parallel direction of the first wire, the first feeding point and the second feeding point are located in two opposite directions, respectively, relative to the third feeding point.

Abstract: A three-dimensional (3D) filter and a fabrication method thereof are provided. The 3D filter includes a circuit board, a first ring resonator, a second ring resonator and a via structure. The circuit board includes a first circuit layer, a second circuit layer and a third circuit layer. The third circuit layer is located between the first circuit board and the second circuit board. The first ring resonator is disposed in the first circuit layer and has a first ring surrounded area corresponding to a first cut-off frequency band. The second ring resonator is disposed in the second circuit layer and has a second ring surrounded area corresponding to a second cut-off frequency band. The via structure passes through the first circuit layer, the second circuit layer and the third circuit layer, and is electrically connected to the first ring resonator and the second ring resonator.

Abstract: A multi-band filter includes a circuit board, a first resonator, a second resonator, and a coupling element configured to couple the first resonator with the second resonator. The coupling element includes a first coupling capacitor, a second coupling capacitor, a first short-circuited stub and a second short-circuited stub. The first coupling capacitor has two terminals electrically connected to the first portion of the first resonator and the first portion of the second resonator respectively. The second coupling capacitor has two terminals electrically connected to the second portion of the first resonator and the second portion of the second resonator respectively. The first short-circuited stub is electrically connected to the first coupling capacitor and a ground plane. The second short-circuited stub is electrically connected to the second coupling capacitor and a ground plane.

Abstract: An array antenna includes a flexible substrate formed by stacked liquid crystal polymer (LCP) layers and has at least one feed point. At least one serial antenna is arranged on the flexible substrate, and a microstrip is extended from the feed point to connect a plurality of radiating elements in series to form the serial antenna. The tail end one of the radiating elements of the serial antenna is connected to one end of a ground microstrip, and another end of the ground microstrip is short-circuited to the ground. The length of the ground microstrip is approximately one fourth of the wavelength of the center frequency of the array antenna. Feeding sections where microstrips feeding to the radiating elements are in a horn and/or groove shape. Desired frequency and bandwidth may be obtained by adjusting lengths and widths of feeding sections respectively.

Abstract: An antenna test system includes a box body, a supporting device, at least one probe device, a signal measuring device, and a moving device. The box body has at least an operation side configured to be opened to allow access to devices inside the box body. The supporting device is disposed in the box body and the antenna circuit to be tested is arranged thereon. The probe device is disposed in the box body and configured to apply an antenna testing signal to the antenna circuit to emit an antenna working signal. The signal measuring device is disposed in the box body to receive the antenna working signal emitted from the antenna circuit. The moving device is disposed in the box body and configured to carry the signal measuring device to maneuver in three directions of X-axis, Y-axis, and Z-axis to receive the antenna working signal in different positions.

Abstract: A millimeter wave radio frequency (RF) structure uses a substrate including a liquid-crystal polymer material, at least one dual-polarized antenna, a RF transceiver module, and a switching module electrically connected to the at least one dual-polarized antenna and the RF transceiver module, where the switching module includes a first switching element and a second switching element electrically connected to the at least one dual-polarized antenna, and a third switching element electrically connected to the first switching element and the second switching element, to enhance characteristics of a liquid-crystal polymer (LCP) substrate for millimeter waves, and implement high-frequency, high-speed transmission while ensuring high reliability.

Abstract: An antenna structure includes a substrate, a plurality of reflective plates, a grounding plate, a radiating member, a signal feeding via and a plurality of conductive vias. The substrate has opposite first and second surfaces and comprises liquid crystal polymer. The reflective plates are arrayed on the first surface of the substrate. The grounding plate is disposed on the second surface of the substrate and overlapped with the reflective plates in a normal direction of the substrate. The grounding plate further includes an opening. The radiating member is disposed on the first surface of the substrate and physically separated from the reflective plates. The signal feeding via is coupled with the radiating member and penetrates through the substrate to be exposed in the opening of the grounding plate. The conductive vias penetrate through the substrate and respectively connect the reflective plates and the grounding plate.

Abstract: An image conversion device includes: a lens module configured to allow passing of image light beams of an object, an optical waveguide element configured to transmit the image light beams to a light processing component, and an image sensor configured to convert the image light beams into digital image signals. By changing image capturing and image forming methods, higher image quality may be achieved and expanding flexibility may be maintained.

Abstract: An appressed antenna includes an antenna housing and a metal shell. The antenna housing comprising a housing and a planar antenna, where the planar antenna is bent with one part folded onto the inner surface of the housing and other part pressed onto the outer surface of the housing. The antenna housing is sleeve fitted to the metal shell with a gap between for the planar antenna to radiate. In this all-metal environment, the position of the antenna is close to the gap opening will increase radiation efficiency. By having at least a branch at the tail end of the appressed antenna, the appressed antenna can have a good return loss and antenna gain.

Abstract: An antenna structure includes a substrate, a plurality of reflective plates, a grounding plate, a radiating member and a plurality of conductive vias. The substrate contains liquid crystal polymer and has opposite first and second surfaces. The reflective plates are arranged in an array on the first surface of the substrate. The grounding plate is arranged on the second surface of the substrate and overlaps with the reflective plates in a normal direction of the substrate. The radiating member is on the second surface of the substrate and does not overlap with the reflective plates in the normal direction of the substrate. The radiating member has an open slot which is defined by a first radiating branch and a second radiating branch that generate at least two different operating frequency bands. The conductive vias respectively penetrate the substrate and connect with the reflective plates and the grounding plate.

Abstract: An array antenna of a radar includes a liquid crystal polymer (LCP) substrate with antenna transceiver circuits embedded. A plurality of patch array antennas are disposed on the LCP substrate and connected to the antenna transceiver circuit. Each patch array antenna includes a plurality of patch antennas connected in series, and the foremost patch antenna has a concave slot on the radiating surface by each side of respective feed line. By use of a LCP substrate can ensure stable material characteristics in different environments. Compared with a single patch antenna, the gain may be improved by 6 dB by connecting four patch antennas in series. A concave slot is formed on a radiating surface of a patch antenna to optimize a feed impedance, thereby to improve a working bandwidth of the antenna to alleviate an excessively narrow bandwidth of a patch antenna.

Abstract: A patch antenna includes a dielectric substrate formed by a high dielectric coefficient material covered with a soft material. The dielectric substrate has a first surface, an opposite second surface, and surrounding side surfaces there between. The patch antenna further includes a radiating metal arm formed on at least the first surface with a thin metal layer in a specific shape, a grounding metal plate disposed on the second surface, and a parasitic metal arm extending from the grounding metal plate towards the first surface via at least one of the side surfaces. The parasitic metal arm is approximate but not connected to the radiating metal arm. The radiation metal arm further includes an enclosed slot, together with the parasitic metal arm, improve the working bandwidth and high directivity of the antenna.

Abstract: A composite antenna and array antenna using the same. The antenna has a three-layer structure including a patch antenna, a slot antenna and a transmission line. A first layer includes a patch antenna resonating at half a wavelength, a second layer includes a slot antenna resonating at half the wavelength, and a third layer includes a transmission line and a feed point. The three layers are coupled and the entire composite antenna unit satisfies a resonance condition. A signal is fed through the transmission line and coupled to the slot antenna, and the signal from the slot antenna is further coupled to the patch antenna. This composition antenna has a desirable antenna gain, and an increased antenna bandwidth compared to a single patch antenna or slot antenna.

Abstract: A method of manufacturing a device with a optical component disposed thereon, including following steps of: preparing a substrate, the substrate including a signal guide and an electric conductive structure; and mounting an optical component on the substrate and corresponding a light transmission face of the optical component to the signal guide, wherein the optical component and the substrate is connected by an adhesive material and the optical component is electrically connected with the electric conductive structure. A transmission device being made by the method of manufacturing the device with the optical component disposed thereon as described above is further provided.