Abstract: An illuminating device has an illuminating assembly and a holding base. The illuminating assembly has a connection element mounted on a top of the illuminating assembly and has a threaded stub formed on and protruding from a top of the connection element. The holding base is connected with the illuminating assembly and has a base body and a nut. The base body a central hole, two fixing holes, and two fasteners. The central hole is defined through the base body and through which the threaded stub of the connection element extends. The fixing holes are defined through the holding base. The fasteners are mounted respectively through the two fixing holes and are adapted to be securely attached to a ceiling or a wall. The nut is screwed with the threaded stub on the connection element.

Abstract: A multi-functional lantern includes a body, at least one light bar and a flashlight assembly. The body has a base, a shell and a handle. The shell is formed on the base and has a distal end, an outer surface and at least one bar mount. The at least one bar mount is defined longitudinally in the outer surface of the shell and has a mounting end. The handle is mounted on the distal end of the shell. The at least one light bar is respectively mounted pivotally in a corresponding bar mount of the shell and is a planar lighting module having multiple diode components and a proximal end mounted pivotally in the mounting end of a corresponding bar mount. The flashlight assembly is mounted on the body.

Abstract: An LED light source model has a substrate, at least one bare LED chip, a transparent layer and an optical light collecting element. The substrate has a top face, a bottom face and at least one chip cup defined on the top face. The at least one LED chip is mounted in the at least one chip cup. The transparent layer is formed on the top face to seal the at least one chip cup. The optical light collecting element is mounted on the top face to collect the light from each chip cup to increase the light intensity. A plurality of fins or recesses are formed or defined on the bottom face to increase a heat dissipation area. When each bare LED chip is in operation mode, heat from the bare LED chip will be conducted to the bottom face and then dissipate to the ambient air quickly.