Abstract: A resonant inter-band tunnel diode (RITD) can be fabricated using semiconductor processing similar to that used for Complementary Metal-Oxide-Semiconductor (CMOS) device fabrication, such as can include using silicon. A memory cell (e.g., a random access memory (RAM) cell) can be fabricated to include one or more negative differential resistance device, such as tunneling diodes, such as to provide a single-bit or multi-bit cell. In an example, a “hybrid” memory cell can be fabricated, such as including one or more negative resistance devices, a MOS transistor structure, and a capacitor structure, such as including an integrated capacitor configuration similar to a generally-available dynamic RAM (DRAM) structure, but such as without requiring a refresh and offering a higher area efficiency.

Abstract: A resonant inter-band tunnel diode (RITD) can be fabricated using semiconductor processing similar to that used for Complementary Metal-Oxide-Semiconductor (CMOS) device fabrication, such as can include using silicon. A memory cell (e.g., a random access memory (RAM) cell) can be fabricated to include one or more negative differential resistance device, such as tunneling diodes, such as to provide a single-bit or multi-bit cell. In an example, a “hybrid” memory cell can be fabricated, such as including one or more negative resistance devices, a MOS transistor structure, and a capacitor structure, such as including an integrated capacitor configuration similar to a generally-available dynamic RAM (DRAM) structure, but such as without requiring a refresh and offering a higher area efficiency.