Abstract: A radioactive power source resident in an IC package is provided. The power source is a stand-alone device, fabricated separately from the IC or other device that is eventually attached to the package. The power source may be attached to the packaging substrate or to another portion of the package such as the package's top member or lid. The source can be directly coupled to the mounted IC, for example via package leads, or coupled to package pins. By coupling the source to the package pins, the system provides even greater flexibility. Although the power source can use any of a variety of different cell designs, preferably an icosahdedral boride based beta cell is used.

Abstract: A radioactive power source resident in an IC package is provided. The power source is a stand-alone device, fabricated separately from the IC or other device that is eventually attached to the package. The power source may be attached to the packaging substrate or to another portion of the package such as the package's top member or lid. The source can be directly coupled to the mounted IC, for example via package leads, or coupled to package pins. By coupling the source to the package pins, the system provides even greater flexibility. Although the power source can use any of a variety of different cell designs, preferably an icosahdedral boride based beta cell is used.

Abstract: A means of supplying power to a chip, device or system is provided. The provided power source includes at least one non-radioactive power source that is preferably capable of supplying high current levels for at least short periods of time. The at least one non-radioactive power source is electrically coupled to at least one radioactive power source, the at least one radioactive power source supplying sufficient power to maintain the desired charge in the non-radioactive power source. In combination, the two power sources offer long life and the ability to respond to short duration, high power demands.