Patents Assigned to R.E. Service Company, Inc.
  • Separator sheet laminate for use in the manufacture of printed circuit boards
    Patent number: 6355360
    Abstract: A sheet laminate for use in a press lay-up between printed circuit board panels having a steel substrate layer and a copper foil layer releasably bonded with resistance welds and adhesive to at least one surface of the substrate layer.
    Type: Grant
    Filed: October 5, 2000
    Date of Patent: March 12, 2002
    Assignee: R.E. Service Company, Inc.
    Inventor: Mark S. Frater
  • Copper/steel laminated sheet for use in manufacturing printed circuit boards
    Patent number: 6235404
    Abstract: A sheet laminate for use in a press lay-up between printed circuit board panels having a steel substrate layer and a copper foil layer releasibly bonded to at least one surface of the substrate layer.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: May 22, 2001
    Assignee: R.E. Service Company, Inc.
    Inventor: Mark S. Frater
  • Copper/steel laminated sheet for use in manufacturing printed circuit boards
    Patent number: 6129998
    Abstract: A sheet laminate for use in a press lay-up between printed circuit board panels having a steel alloy substrate layer and a copper foil layer disposed on at least one surface of the substrate layer. The foil layer is attached onto the surface of the substrate layer by a plurality of occurrences of adhesive material disposed along the boundary of the foil layer such that gaps are defined between occurrences of the adhesive material.
    Type: Grant
    Filed: April 10, 1998
    Date of Patent: October 10, 2000
    Assignee: R.E. Service Company, Inc.
    Inventor: Mark S. Frater