Abstract: A tray for ball grid array integrated circuits includes a storage pocket with a transverse structure. The transverse structure carries a plurality of columnar structures at spaced positions on and extending normally from the surface of the transverse structure. Each columnar support structure includes parallel columns that terminate in coplanar free ends that engage the terminal surface of one ball grid array integrated circuit to support it in a terminals down position within the storage pocket.

Abstract: A tray for storage and transportation of multiple staggered integrated circuit components, each having a planar housing and plurality of terminal pins arranged in spaced rows. The tray has a framework for supporting upstanding ribs that interfit between adjacent integrated circuit components. Each upstanding rib lies along an axis in one of two sets of intersecting axes and aligns with and fits between certain spaced rows to position the terminal pin in precise alignment with the tray. The rib axes are intersecting and oblique to the general tray orientation. Positioning fingers provide initial positioning to align the terminal pins and ribs. Pedestals define a support plane and support the integrated circuit with the terminal pins spaced from a base plate.

Abstract: A tray for storage and transportation of multiple pin grid array (PGA) integrated circuit components each having a planar housing and plurality of terminal pins arranged in spaced rows. The tray has a framework for supporting upstanding ribs that engage the integrated circuit component. Each upstanding rib lies along an axis in one of two sets of intersecting axes and aligns with and fits between certain spaced rows to support the bottom of the component.

Abstract: A tray for storage and transportation of multiple pin grid array (PGA) integrated circuit components each having a planar housing and plurality of terminal pins arranged in spaced rows. The tray has a framework for supporting upstanding ribs that engage the integrated circuit component. Each upstanding rib lies along an axis in one of two sets of intersecting axes and aligns with and fits between certain spaced rows to support the bottom of the component.

Abstract: A tray for the storage and transportation of multiple ball grid array (BGA) integrated circuit components in either of two component orientations. The tray has a lattice framework that defines discrete storage pocket areas. First inwardly facing tabs on the framework define a first support plane for engaging a component is a first orientation of the tray and component. Second inwardly facing tabs on the framework define a second support plane for engaging the component in the second orientation of the tray and component. The framework includes oppositely directed central and corner extensions that stabilize the component in the housing plane in either orientation and a registration structure for allowing the plural trays to be stacked for transport in either orientation.

Abstract: A carrier for a flatpack integrated circuit component. The carrier includes a square frame formed of a conductive plastic and a series of electrically isolating comb inserts for supporting terminals from a flat pack integrated circuit component. Elongated slots at each of the corners of the frame support linearly reciprocal slide tabs that move between first and second positions. In the first position a finger from each slide tab overlies the frame member; in a second position the finger overlies either a portion of the component housing or a portion of the comb inserts and at least one terminal from the integrated circuit in the comb at each corner thereby to retain the component in the carrier.

Abstract: A carrier adapted for diverse electrical and electronic components to facilitate shipping, handling and testing of these components. The carrier comprises a conductive frame and an electrically isolating insert. The insert electrically isolates each terminal lead of the component from other terminal leads as well as from all conductive material. The conductive frame abuts additional surfaces of the insulative insert, as well as forming most external surfaces of the carrier structure, thereby dissipating any electrostatic charges that can accumulate. The electrically isolating insert comprises a moldable plastic material having a limited amount of conductive filler such that the surface resistivity of the insert is at least 10.sup.10 ohms.

Abstract: A carrier system for PGA components comprising a carrier frame and a removable retaining means for capturing a PGA component against an insulating plate in the carrier frame. Bumpers at opposite ends of the carrier dissipate mechanical shocks to protect the component. A removable alignment means coacts with the carrier frame to facilitate the positioning of a PGA component on the insulating plate. A removal means facilitates the disengagement of the removable retaining means from the carrier frame when it is appropriate to remove the PGA component.

Abstract: A carrier system for facilitating the production of electrical assemblies with electrical components including a component carrier and a fixture for facilitating component insertion and removal with the carrier. The carrier comprises an open rectangular peripheral skirt with a transverse support plate for engaging a component housing. Spaced flexible bowed retaining arms extend across the peripheral skirt. Each arm has a clip extension for securing the component housing in the carrier. Central operating structures on each retaining arm facilitate movement between first and second positions. Slide tabs on each arm coact with the peripheral skirt to prevent rotation of the retaining arms during motion. Operating tabs are spaced at fixed positions relative to the peripheral skirt. Supporting plates interconnect each tab to a respective operating arm that is positioned within the peripheral skirt as a function of component housing size.

Abstract: Carriers for electronic components in transistor outline packages with terminals arranged in circular or rectangular arrays. The carrier has a conductive frame including a planar portion, side rails and a housing section disposed along an axis transverse to the planar section. The housing contains an insert of insulating material with apertures disposed in an array corresponding to the terminal array thereby to grip at least some of the terminals and electrically isolate those terminals from each other. The insert has a length along the transverse axis that is at least coextensive with the terminals thus to isolate the terminals completely. A portion of the insert extends along the planar surface and the insert is open to receive the terminal test leads or other mechanisms for testing the component. Specific embodiments for TO packages with a different terminal arrays are disclosed.

Abstract: A carrier system for PGA components comprising a carrier frame and a removable retaining means for capturing a PGA component against an insulating plate in the carrier frame. Bumpers at opposite ends of the carrier dissipate mechanical shocks to protect the component. A removable alignment means coacts with the carrier frame to facilitate the positioning of a PGA component on the insulating plate. A removal means facilitates the disengagement of the removable retaining means from the carrier frame when it is appropriate to remove the PGA component.

Abstract: A spring for each end of a tubular carrier to secure them against sliding and slipping within the tube. The spring having a tongue carrying on its tip an upwardly jutting pin which is upwardly resilient. The pin latches into through apertures in the top wall of the carrier and may have a camming means forward of the pin comprising a pair of ramps extending forward and down from the pin and symmetrical about a longitudinal axis.The tongue has a base and in one embodiment extends rearward of the base. In a preferred embodiment the tongue has a base and extends forward of the base. The tongue may have a surround, and in the preferred embodiment the tongue may extend forward of a lower ledge at the rear of the surround.In use, as the spring enters the carrier against a chip, the pin is cammed down. When the spring is compressed against the chip sufficiently, the pin enters an aperture in the top wall of the carrier, and latches the spring.