Patents Assigned to R-Theta Thermal Solutions Inc.
  • Base plate for a dual base plate heatsink
    Patent number: 7819173
    Abstract: A dual base plate heatsink for use in dissipating heat for electronic devices with thermal contact between fins and the base plates and manufactured without welding. Separately extruded fins are connected to both base plates by placing the fins side by side in channels in both base plates. In order to couple the base plates and finds, the base plates are maintained at a constant relative distance and a swaging tool is passed adjacent the fins and between the base plates in a direction parallel to the surface of the base plates. The swaging tool applies pressure to the base plates to thereby swage the base plates against the ends of the fins.
    Type: Grant
    Filed: January 21, 2009
    Date of Patent: October 26, 2010
    Assignee: R-Theta Thermal Solutions Inc.
    Inventor: Ahmed Zaghlol
  • BASE PLATE FOR A DUAL BASE PLATE HEATSINK
    Publication number: 20090178796
    Abstract: A dual base plate heatsink for use in dissipating heat for electronic devices with thermal contact between fins and the base plates and manufactured without welding. Separately extruded fins are connected to both base plates by placing the fins side by side in channels in both base plates. In order to couple the base plates and finds, the base plates are maintained at a constant relative distance and a swaging tool is passed adjacent the fins and between the base plates in a direction parallel to the surface of the base plates. The swaging tool applies pressure to the base plates to thereby swage the base plates against the ends of the fins.
    Type: Application
    Filed: January 21, 2009
    Publication date: July 16, 2009
    Applicant: R-THETA THERMAL SOLUTIONS INC.
    Inventor: Ahmed Zaghlol
  • Method and apparatus for coupling fins in a high-fin density heatsink to dual heat-dissipating base plates
    Patent number: 7497013
    Abstract: A dual base plate heatsink for use in dissipating heat for electronic devices with thermal contact between fins and the base plates and manufactured without welding. Separately extruded fins are connected to both base plates by placing the fins side by side in channels in both base plates. In order to couple the base plates and the fins, the base plates are maintained at a constant relative distance and a swaging tool is passed adjacent the fins and between the base plates in a direction parallel to the surface of the base plates. The swaging tool applies pressure to the base plates to thereby swage the base plates against the ends of the fins.
    Type: Grant
    Filed: April 15, 2005
    Date of Patent: March 3, 2009
    Assignee: R-Theta Thermal Solutions Inc.
    Inventor: Ahmed Zaghlol