Patents Assigned to R4 Ventures, LLC
  • Real-Time Individual Electronic Enclosure Cooling System
    Publication number: 20150153109
    Abstract: This discloses apparatuses for cooling individual server racks or electrical enclosures. These devices maintain target enclosure temperatures within plus or minus 1 or 2 degrees F. The devices employ industrial cooling using staged cooling towers to evaporatively reach temperatures below the wet bulb temperature of the ambient air. Methods for using such apparatuses are disclosed as well.
    Type: Application
    Filed: October 13, 2014
    Publication date: June 4, 2015
    Applicant: R4 Ventures LLC
    Inventors: Mikhail Pavlovich Reytblat, Darrell Richardson
  • Advanced multi-purpose, multi-stage evaporative cold water/cold air generating and supply system
    Patent number: 8899061
    Abstract: An industrial heat load evaporative cooling system. The system includes multiple cooling towers and includes cooling coil heat transfer equipment locally associated with an industrial heat load, with the system subject to command and control equipment.
    Type: Grant
    Filed: September 22, 2012
    Date of Patent: December 2, 2014
    Assignee: R4 Ventures, LLC
    Inventor: Mikhail Pavlovich Reytblat
  • Real time individual electronic enclosure cooling system
    Patent number: 8857204
    Abstract: A computer server enclosure (such as in a server farm) evaporative cooling system. The system includes multiple cooling towers and includes cooling coil heat transfer equipment locally associated with a server enclosure or group of server enclosures, with the system subject to command and control equipment.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: October 14, 2014
    Assignee: R4 Ventures LLC
    Inventor: Mikhail Pavlovich Reytblat
  • REAL TIME INDIVIDUAL ELECTRONIC ENCLOSURE COOLING SYSTEM
    Publication number: 20130133350
    Abstract: This discloses apparatuses for cooling individual server racks or electrical enclosures. These devices maintain target enclosure temperatures within plus or minus 1 or 2 degrees F. The devices employ industrial cooling using staged cooling towers to evaporatively reach temperatures below the wet bulb temperature of the ambient air. Methods for using such apparatuses are disclosed as well.
    Type: Application
    Filed: January 23, 2013
    Publication date: May 30, 2013
    Applicant: R4 Ventures, LLC
    Inventor: R4 Ventures, LLC