Abstract: A locking push pin and methods of using the locking push pin to assemble a heatsink assembly, are described. The locking push pin includes a body lumen extending through a pin body, and several prongs radially outward from the body lumen. Peripheral surfaces of the prongs are separated by a body slot radially outward from the body lumen. The locking push pin includes a pin lock having a branch that extends through the body lumen and into the body slot between the peripheral surfaces. The pin lock advances from an unlocked configuration in which the branch is in the body slot proximal to a distal end of the prongs, allowing the prongs to deflect radially inward, to a locked configuration in which the branch is in the body slot at the distal end of the prongs, blocking deflection of the prongs. Other embodiments are also described and claimed.

Abstract: A heatsink retainer assembly, and components of the heatsink retainer assembly, are described. The heatsink retainer assembly includes one or more heatsink anchors mounted on a heatsink retention wire between several stops. The anchors include channels to receive the retention wire such that the anchors can slide over the retention wire between the stops. The stops retain the anchors on the retention wire. The anchors can be inserted into respective mounting holes of a carrier substrate by pressing the anchors into the mounting holes on a side of the carrier substrate carrying a heat source. A heatsink can be mounted on the heat source and the retention wire can extend over the heatsink to retain the heatsink against the heat source when the anchors are secured to the carrier substrate. Other embodiments are described and claimed.

Abstract: An interlocking clip heatsink mounting system (10) is provided for securing a heatsink (12) in optimal thermal contact with a chip carrier (14). The clip structure (24) includes a pair of identical interlocking clip members (28) and a spring member (26). The clip side members (28) are provided with crenellations (50) and hook wedges (62) so as to interlock in partially engaged and fully engaged modes.

Abstract: An interlocking clip heatsink mounting system (10) is provided for securing a heatsink (12) in optimal thermal contact with a chip carrier (14). The clip structure (24) includes a pair of identical interlocking clip members (28) and a spring member (26). The clip side members (28) are provided with crenellations (50) and hook wedges (62) so as to interlock in partially engaged and fully engaged modes.