Abstract: A furnace for reflowing solder on a wafer having a heating chamber with an entrance, an exit, and top, bottom, side, and end walls formed of sheets of porous insulation. The furnace has a first belt, with first and second ends, extending from a loading position into the heating chamber. The furnace has a second belt, with first and second ends; the first end of the second belt is coupled to the second end of the first belt, the second belt extending through the heating chamber. The furnace has a third belt with first and second ends; the first end of the third belt is coupled to the second end of the second belt, the third belt extending through the exit of the heating chamber to an unloading position. The heating chamber also has infrared lamps positioned below the second belt, the infrared lamps heat the second belt, such that the second belt heats the wafer situated on the second belt.