Patents Assigned to RADIO PHYSICS SOLUTION LIMITED
  • PACKAGE FOR HIGH FREQUENCY CIRCUITS
    Publication number: 20140231117
    Abstract: The present invention relates to integrated circuit packaging and methods of manufacturing these. In particular, but not exclusively the present invention relates to improvements in the suppression of spurious wave modes within cavity packages in which are mounted circuits operating at high frequencies, for example Monolithic Microwave Integrated Circuits (MMIC's).
    Type: Application
    Filed: September 19, 2012
    Publication date: August 21, 2014
    Applicant: RADIO PHYSICS SOLUTION LIMITED
    Inventors: Jim Yip, Paul Rice, Mark Black