Abstract: A highly flexible and scalable architecture implements TDM bridge and related functions for network to telecom interface applications like voice over Internet. A very small packet size minimizes packetization delay so that VOIP can be realized without expensive echo cancellation. High density enables processing 4K simultaneous voice channels in real time on a single, compact circuit board.

Abstract: A highly flexible and scalable architecture implements a wide variety of protocol bridging, including ATM SARing (segmentation and reassembly) operations and related functions with single call granularity for network to telecom interface applications such as voice over Internet. A very small packet size minimizes packetization delay so that VOIP can be realized without expensive echo cancellation.

Abstract: The present invention relates to a method and apparatus of heat dispersion from the bottom side of an integrated circuit package mounted on a printed circuit board (“PCB”). In operation, a heat slug is thermally coupled to the underside of an integrated circuit (“IC”) package. In one embodiment, the heat slug comprises a disc made of copper or other thermally conductive material in between two layers of elastomeric, conductive material such as silicone imbedded with aluminum particles. The thermal pad extends through each layer of the PCB, including the ground layer. In this way, the ground layer of the PCB is utilized for heat dispersion.

Abstract: An embedded microprocessor control system temporarily slows a microprocessor clock input signal in response to a reset strobe. This permits the peripherals to synchronize the classification of their clock phases with 386 microprocessor clock phase classifications.