Patents Assigned to RadPax, Inc.
  • Patent number: 8404071
    Abstract: Various processes for the creation of a film to film bond using printed patterns of adhesive traces. In some implementations of the process, control of the process including control of the temperature of the adhesive and film to a temperature approaching the heat distortion temperature for the film will vary the strength of the bond from a frangible bond to a bond the tears the film, (a film-tearing bond). Some implementations of the process may be used to produce bonded films at web speed rates that are significantly higher than commercial rates for heat seal processes.
    Type: Grant
    Filed: March 16, 2007
    Date of Patent: March 26, 2013
    Assignee: RadPax, Inc.
    Inventors: Dennis Allen Cope, Thomas Charles Brough