Patents Assigned to Radstone Technology Limited
  • Patent number: 5010444
    Abstract: A circuit board (10) is described in which VMEbus connectors (15), wedge-lock clamping means (19), and a heat management layer (13) are mounted on the same side of the board as that whereon the components are mounted and wherein edge guides, are provided in thermal contact with the heat management layer but present heat dissipating surfaces at the opposite side of the board.
    Type: Grant
    Filed: October 24, 1989
    Date of Patent: April 23, 1991
    Assignee: Radstone Technology Limited
    Inventors: Alan J. Storrow, Nigel J. Knighton