Abstract: The present invention relates to a method for manufacturing a label comprising a transponder on an integrated process line. The transponder comprises an antenna and an integrated circuit on a chip.

Abstract: The Invention relates to a method for the manufacture of a smart label web. The smart label web comprises smart labels placed one after another and/or side by side and comprising a circuitry pattern and an integrated circuit on a chip therein. In the method, an electrical contact is formed between the integrated circuit on a chip and the circuitry pattern of the smart label in the smart label web in such a way that a structural part separated from a separate carrier web and comprising an integrated circuit on a chip is attached to the smart label. The structural part contains a thermoplastic material whereby it is attached to the smart label.

Abstract: A method for forming a joint. A module is introduced including a paper or plastic substrate, an integrated circuit on a chip mounted on the substrate and in electrical contact with contact areas of the module being located on the surface of the substrate. A web is introduced including one circuitry pattern after another provided with contact areas of the circuitry pattern. Settable isotropically conductive adhesive is dispensed on the contact areas of the circuitry pattern. The contact areas of the module are attached to the contact areas of the circuitry pattern by the isotropically conductive adhesive. The isotropically conductive adhesive is cured at the ambient atmospheric pressure. Settable nonconductive adhesive is dispensed at the side of the module in such a manner that the adhesive is sucked underneath the module by capillary forces. The nonconductive adhesive is cured at the ambient atmospheric pressure.

Abstract: The invention relates to an injection moulded product comprising an attached body which has been attached by an intermediate layer. The body has been attached to the injection moulded product by an intermediate layer attached to the body prior to the injection moulding. The invention also relates to a method for the manufacture of an injection moulded product comprising a body which has been attached by an intermediate layer.

Abstract: The present invention relates to manufacture of a smart label web, the smart label web comprising smart labels one after another and/or side by side. The smart label web comprises also a circuitry pattern and an integrated circuit on a chip attached to it. In the method, an electric contact is formed between the integrated circuit on the chip and the circuitry pattern on the smart label of the smart label web in such a way that a structural part separated from a separate carrier web and containing the integrated circuit on the chip is electrically connected to the smart label by pressing mechanically. The structural part or the smart label comprises a thermoplastic film whereby the structural part is attached to the smart label substantially entirely.

Abstract: A smart label comprises a circuitry pattern on a smart label substrate and a structural part comprises an integrated circuit on a chip on a structural part substrate. The structural part is attached to the smart label substrate and/or the circuitry pattern. The circuitry pattern is electrically connected to the integrated circuit on the chip via at least one capacitor located outside the chip.

Abstract: The invention relates to a method for forming a product sensor, and a product sensor. The product sensor is formed on a substrate and provided with at least one electric circuit comprising at least one capacitor and at least one coil. At least part of the electric circuit is formed by evaporating a first metallization layer at least at the electric circuit in the product sensor.

Abstract: The present invention relates to a smart card web comprising a carrier web which comprises circuitry patterns, each having an integrated circuit at suitable spaces one after another and/or next to each other and at least one cover web attached to the carrier web. The carrier web and the cover web are attached by a thermoplastic adhesive bonding film web.

Abstract: A method for manufacturing a smart label web comprises smart labels placed one after and/or next to each other and comprising a circuitry pattern and an intergrated circuit on a chip therein. In the method, an electric contact is formed between the integrated circuit on the chip and the circuitry pattern on the smart label of the smart label web. The integrated circuit on the chip is attached to the circuitry of the smart label by means of a thermoplastic film on the surface of the chip.

Abstract: The invention relates to a method for the manufacture of a smart label web. The smart label web comprises smart labels placed one after another and/or side by side and comprising a circuitry pattern and an integrated circuit on a chip therein. In the method, an electrical contact is formed between the integrated circuit on a chip and the circuitry pattern of the smart label in the smart label web in such a way that a structural part separated from a separate carrier web and comprising an integrated circuit on a chip is attached to the smart label. The structural part contains a thermoplastic material whereby it is attached to the smart label.

Abstract: The invention relates to a smart card web comprising a carrier web whose softening temperature is at least 110° C., preferably about 180° C., and a cover web whose softening temperature is not higher than 110° C. The invention also relates to a method for the manufacture of a smart card web. In the method, the smart card web is manufactured as a continuous web comprising a carrier web and a cover web attached to each other.

Abstract: In a method for the manufacture of a smart label inlet web, a surface web, a smart label web and a back web are attached to each other. Integrated circuits are attached in a continuous manner to each smart label of the smart label web before the webs are attached to each other on the same production line. The present invention also relates to a device for the manufacture of a smart label inlet web.

Abstract: The invention relates to a method for forming a product sensor, and a product sensor. The product sensor is formed on a substrate and provided with at least one electric circuit comprising at least one capacitor and at least one coil. At least part of the electric circuit is formed by evaporating a first metallization layer at least at the electric circuit in the product sensor.

Abstract: The invention relates to a method for the manufacture of a smart label inlet web, in which method a smart label is protected from external effects by means of a surface film coated with an adhesive, the adhesive being in contact with the smart label. The adhesive is cured by radiation. The invention also relates to a smart label inlet web comprising a surface film, a smart label and a back web attached to each other. The surface film is attached to the smart label with an adhesive cured by radiation.