Patents Assigned to Raines Technologies, Inc.
  • Plasma etching apparatus and method and apparatus for verifying a wafer
    Patent number: 6027605
    Abstract: Wafer verifying apparatus for receiving a wafer thereagainst and for verifying the wafer, wafer verifying apparatus comprising a fixture including a stage for receiving thereagainst a surface of the wafer, a vacuum assembly for effecting a vacuum coupling of the surface of the wafer to the stage, and sensor apparatus for accepting the wafer in the presence of a vacuum couple of the surface of the wafer against the stage and for rejecting the wafer absent a vacuum couple of the surface of the wafer against the stage.
    Type: Grant
    Filed: May 22, 1998
    Date of Patent: February 22, 2000
    Assignee: Raines Technologies, Inc.
    Inventors: Mark D. Lehmann, Dorman Raines, Charles A. Stamps