Abstract: A wafer transfer robot apparatus based on a direct drive motor, includes: a hand module including a hand loading a wafer from one surface and a hand arm coupled to the hand to transfer the wafer; an R-axis module; a connecting enclosing module having one end coupled to the R-axis module; and a T-axis module rotatably coupled to the connecting enclosure module.
Type:
Grant
Filed:
September 6, 2022
Date of Patent:
July 15, 2025
Assignee:
RAONTEC INC.
Inventors:
Jin Ho Oh, Sang Chan Choi, Zheng Yuan Li
Abstract: An articulated work robot device includes: a lower body; a bridgehead coupled to a common axis at a first position of the lower body to be rotatable; first and second articulated arms configured to be overlapped with each other up and down, and having first ends respectively disposed at second and third positions opposite to each other with respect to the common axis on the bridgehead to be rotatable together through the common axis; first and second plurality of hands respectively coupled at second ends of the first and second articulated arms through scissor links; and first and second composite drive modules disposed in an internal space of the bridgehead and driving the first and second articulated arms and the first and second plurality of hands, respectively.
Type:
Application
Filed:
December 7, 2023
Publication date:
October 24, 2024
Applicant:
RAONTEC Inc.
Inventors:
Hyunseok JANG, Kwangmin JUNG, Geun Young JANG, Sang Hyuk JEON, Hyun Sik MOON
Abstract: A wafer transfer robot apparatus based on a direct drive motor, includes: a hand module including a hand loading a wafer from one surface and a hand arm coupled to the hand to transfer the wafer; an R-axis module; a connecting enclosing module having one end coupled to the R-axis module; and a T-axis module rotatably coupled to the connecting enclosure module.
Type:
Application
Filed:
September 6, 2022
Publication date:
May 4, 2023
Applicant:
RAONTEC Inc.
Inventors:
Jin Ho OH, Sang Chan CHOI, Zheng Yuan LI