Patents Assigned to Rapid Analysis and Development Company
  • Jet soldering system and method
    Patent number: 6186192
    Abstract: An apparatus for filling filtered solder into replaceable solder cartridges for use in a system for depositing a selected pattern of solder onto a substrate on which electronic components are to be mounted. The apparatus includes a cartridge support, an environmentally-controlled chamber, a solder receptacle, a heater, a molten solder flow conduit, and a separator.
    Type: Grant
    Filed: August 7, 1997
    Date of Patent: February 13, 2001
    Assignee: Rapid Analysis and Development Company
    Inventors: Melissa E. Orme-Marmarelis, Eric Phillip Muntz, Gerald C. Pham-Van-Diep, Robert F. Smith, Jr.