Abstract: An apparatus for filling filtered solder into replaceable solder cartridges for use in a system for depositing a selected pattern of solder onto a substrate on which electronic components are to be mounted. The apparatus includes a cartridge support, an environmentally-controlled chamber, a solder receptacle, a heater, a molten solder flow conduit, and a separator.
Type:
Grant
Filed:
August 7, 1997
Date of Patent:
February 13, 2001
Assignee:
Rapid Analysis and Development Company
Inventors:
Melissa E. Orme-Marmarelis, Eric Phillip Muntz, Gerald C. Pham-Van-Diep, Robert F. Smith, Jr.
Abstract: An apparatus for depositing a selected pattern of solder onto a substrate on which electronic components are to be mounted. The apparatus includes a substrate support, a replaceable solder cartridge, and a solder ejector. The replaceable solder cartridge defines a cavity for containing solder and has an orifice for ejecting a continuous stream of molten solder. The solder ejector has a mechanism for retaining the replaceable solder cartridge during solder deposition and is positioned relative to the substrate support to deposit molten solder ejected from the orifice of the replaceable solder cartridge onto the substrate.
Type:
Grant
Filed:
September 24, 1996
Date of Patent:
April 20, 1999
Assignee:
Rapid Analysis Development Company
Inventors:
Melissa E. Orme-Marmarelis, Eric Phillip Muntz