Patents Assigned to Rapid Bridge LLC
  • Patent number: 7882453
    Abstract: A pool of die designs includes die designs having metal programmable base layers. Die designs from the pool are selected for use in fabricating dies. Die designs are added to the pool by customization of die designs already in the pool or by preparing custom die designs that incorporate a metal programmable base layer. In some embodiments multi-tile dies are provided with I/O slots configurable for either inter tile communication or inter die communication.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: February 1, 2011
    Assignee: Rapid Bridge LLC
    Inventors: Behnam Malekkhosravi, David Ian West
  • Patent number: 7802216
    Abstract: A semiconductor integrated circuit including a circuit for adaptive power supply regulation and designed using a process that increases operating speed used for characterizing circuit operation at a slow corner. In some embodiments a slow corner voltage is set to a higher than expected level for timing analysis performed by automated design tools.
    Type: Grant
    Filed: September 13, 2007
    Date of Patent: September 21, 2010
    Assignee: Rapid Bridge LLC
    Inventors: Behnam Malek-Khosravi, Michael Brunolli
  • Patent number: 7642809
    Abstract: A metal configurable I/O structure for an integrated circuit is disclosed. The metal configurable I/O structure may be configured for one of any of a plurality of I/O specifications. Preferably a common voltage reference and a common current reference is generated for provision to a plurality of I/O structures.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: January 5, 2010
    Assignee: Rapid Bridge LLC
    Inventors: Behnam Malekkhosravi, Daniel J. Woodard, David Ian West
  • Patent number: 7472304
    Abstract: An extendible timing architecture for an integrated circuit is disclosed. The extendible timing architecture provides metal programmable components for use with different operational clock frequencies. In some embodiments the architecture utilizes master/slave DLLs with a double data rate memory circuit.
    Type: Grant
    Filed: August 30, 2006
    Date of Patent: December 30, 2008
    Assignee: Rapid Bridge, LLC
    Inventors: Behnam Malekkhosravi, Nadim Hashim Shaikli
  • Patent number: 7032191
    Abstract: A system for integrated circuit (IC) design. A structural multi-project wafer (SMPW) comprises a plurality of pre-manufactured and pre-validated functional blocks. The SMPW is pre-fabricated up to a contact layer so that a user can customize and program different blocks of the SMPW to the user's requirements. An SMPW provider maintains an inventory of SMPWs. If one of the SMPWs can meet all of a user's IC design requirements, or can serve an intermediate step in a user's IC design process, such as market/concept validation or IP validation, the SMPW is provided to the user. The user can then proceed directly to production using a streamlined design flow having a very short cycle time of 1–3 months. Otherwise, the user proceeds to production using a normal design flow having a much longer cycle time.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: April 18, 2006
    Assignee: Rapid Bridge LLC
    Inventors: Behnam Malekkhosravi, Daniel J. Woodard