Abstract: A flip chip Surface Mount Fuse is disclosed. This fuse is comprised of a generally rectangular insulating member having a groove across its full length. A fuse element is placed inside the elongated groove and thick film metallizations are provided, through printing techniques, on opposite sides of the insulating member inside the groove to secure the fuse element and to provide termination to the insulating member. The opening of the groove is filled with an electrically insulating coating. The coating can be applied to form a time delay fuse or a fast acting fuse. Fuses can be manufactured in any desired size.