Abstract: An IGBT module includes a heat dissipation base plate. A first ceramic heat dissipation element is embedded in the heat dissipation base plate. A first wiring layer is provided on the surface of the heat dissipation base plate. The first side of an IGBT chip is mounted onto the first wiring layer. The second side of the IGBT chip is provided with a heat conductive metal plate. A first heat dissipation plate having a first through hole is provided on a side of the first wiring layer. The IGBT chip and the heat conductive metal plate are located in the first through hole. A second wiring layer is provided on a side of the first heat dissipation plate away from the IGBT chip. The second wiring layer is provided on a side of the heat conductive metal plate.
Type:
Grant
Filed:
January 22, 2017
Date of Patent:
August 31, 2021
Assignee:
RAYBEN TECHNOLOGIES (ZHUHAI) LIMITED
Inventors:
Shan Zhong, Weidong Gao, Qizhao Hu, Wai Kin Raymond Lam
Abstract: An IGBT module includes a heat dissipation base plate. A first ceramic heat dissipation element is embedded in the heat dissipation base plate. A first wiring layer is provided on the surface of the heat dissipation base plate. The first side of an IGBT chip is mounted onto the first wiring layer. The second side of the IGBT chip is provided with a heat conductive metal plate. A first heat dissipation plate having a first through hole is provided on a side of the first wiring layer. The IGBT chip and the heat conductive metal plate are located in the first through hole. A second wiring layer is provided on a side of the first heat dissipation plate away from the IGBT chip. The second wiring layer is provided on a side of the heat conductive metal plate.
Type:
Application
Filed:
January 22, 2017
Publication date:
November 21, 2019
Applicant:
RAYBEN TECHNOLOGIES (ZHUHAI) LIMITED
Inventors:
Shan ZHONG, Weidong GAO, Qizhao HU, Wai Kin Raymond LAM
Abstract: Disclosed is a power module with built-in power device and double-sided heat dissipation and a manufacturing method thereof. The power module includes a first base plate including a first organic insulating base material, a first electrical insulating heat dissipation body, a first metal layer, and a patterned second metal layer; a second base plate including a second organic insulating base material and a second electrical insulating heat dissipation body. A third metal layer thermally connected to a side of the second electrical insulating heat dissipation body is formed at the outer side of the second base plate. A fourth metal layer thermally connected to the second electrical insulating heat dissipation body is formed at another side of the second electrical insulating heat dissipation body. The fourth metal layer is formed with a concave power device accommodating space, and the power device is arranged in the accommodating space.
Type:
Application
Filed:
April 19, 2018
Publication date:
June 27, 2019
Applicant:
RAYBEN TECHNOLOGIES (ZHUHAI) LIMITED
Inventors:
Wai Kin Raymond Lam, Ho Wai Derek Leung, Aibing Chen, Weidong Gao
Abstract: The present invention provides a device module embedded with switch chip and a manufacturing method thereof, the device module includes: a double-sided circuit board, the first surface of the double-sided circuit board is provided with first pads, and the second surface opposite to the first surface is provided with second pads; a heat dissipation substrate embedded with an electric insulation heat dissipation body and arranged at a side of the first surface of the double-sided circuit board; a switch chip embedded in a heat dissipation substrate, the pins of the switch chip are soldered to the first pads, and the other side of the switch chip opposite to the side of the pins is thermally connected to the electric insulation heat dissipation body; energy storage device, whose pins are soldered to the second pads.
Type:
Application
Filed:
April 18, 2018
Publication date:
June 27, 2019
Applicant:
RAYBEN TECHNOLOGIES (ZHUHAI) LIMITED
Inventors:
Wai Kin Raymond LAM, Ho Wai Derek LEUNG, Aibing CHEN, Weidong GAO
Abstract: The present invention relates to a manufacturing method of a printing circuit board. The manufacturing method mainly includes: forming one or more cylindrical micro-radiators by cutting a high conductive and electrical insulating substrate according to predetermined size; manufacturing one or more mounting holes in copper clad plates and prepregs; embedding the cylindrical micro-radiators into the mounting holes. The present invention combines the micro-radiator with high thermal conductivity and traditional stiffness printing circuit board. The printing circuit board with micro-radiators has the advantages of high thermal conductivity and stable heat transfer, and also has the advantages of routing flexibility and reliable electrical connections.