Abstract: A method of applying a dye image to a plastic member and the image bearing member thereby formed. A disperse dye having a melting point which is below the thermal deflection temperature of the plastic of the member and a vaporization point which is above said deflection temperature is applied to a surface of the member in a desired image. The dye bearing plastic is then heated to a temperature which is above the melting point of the dye and below the thermal deflection temperature of the plastic, but which is nevertheless high enough to cause some softening of said plastic. The dye is then permitted to diffuse into the plastic to provide a sharp, clear and durable image thereon.

Abstract: An ultraviolet reactive ink is applied to a translucent substrate in the desired circuit image and partially cured to a tacky state with ultraviolet radiation. A resist material is then applied to the substrate in the negative circuit image and metallic particles are deposited on the ink by vacuum deposition. The ink is then further cured to a hardened state with ultraviolet radiation applied from both above and beneath the substrate to counteract the tendency of the metal to reflect radiation applied only from above the substrate. Finally, the resist material is removed from the substrate leaving the fully formed circuit board comprising the substrate, the fully cured ink circuit image bonded thereto, and a metallic conductive layer on the ink.