Patents Assigned to RAYSON ELECTRICAL MFG. LTD.
  • Patent number: 10562224
    Abstract: The present invention discloses a heat-resistant glue roll structure with discharge through holes, which comprises a shaft sleeved with a high-temperature resistance insulation layer on the surface thereof. Multiple discharge through holes are formed on the high-temperature resistance insulation layer and communicate the outer and inner surface of the high-temperature resistant insulation layer. A heat-resistant soft glue outer layer is also sleeved on the surface of the high-temperature resistant insulation layer. Since the high-temperature resistant insulation layer is provided with the discharge through holes in the present invention, air bubbles generated both between the high-temperature resistant insulation layer and the heat-resistant soft glue outer layer and between the high-temperature resistant insulation layer and the shaft would be squeezed to move towards the discharge through holes and discharged therefrom.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: February 18, 2020
    Assignee: RAYSON ELECTRICAL MFG. LTD.
    Inventor: Yongjun Chen