Patents Assigned to Raytech Composites, Inc.
  • Patent number: 7708863
    Abstract: A process and apparatus for making die-dried friction wafers collects friction particulates in a mold defining a wafer. The mold includes at least one perforate wall portion against which an aqueous slurry including the particulates is passed to form at least one layer on the wall as the particulates collect in the mold. The collection is dried followed by curing, and may be cured in the mold by heating.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: May 4, 2010
    Assignee: Raytech Composites, Inc.
    Inventors: Angela L. Petroski, Samuel A. Truncone, James Macey, Hualin Jiang
  • Publication number: 20090025898
    Abstract: A process and apparatus for making die-dried friction wafers collects friction particulates in a mold defining a wafer. The mold includes at least one perforate wall portion against which an aqueous slurry including the particulates is passed to form at least one layer on the wall as the particulates collect in the mold. The collection is dried followed by curing, and may be cured in the mold by heating.
    Type: Application
    Filed: August 24, 2006
    Publication date: January 29, 2009
    Applicant: Raytech Composites, Inc.
    Inventors: Angela L. Petroski, Samuel A. Truncone, James Macey, Hualin Jiang
  • Patent number: 7354638
    Abstract: A wet friction material is disclosed bonded to a plate for transmission of motion, with the friction material made up of a porous fiber substrate, which is at least partially impregnated with a catalyzed resorcinol diglycidyl ether resin to improve properties.
    Type: Grant
    Filed: January 12, 2006
    Date of Patent: April 8, 2008
    Assignee: Raytech Composites, Inc.
    Inventors: Laurie Bowles, Samuel Truncone, Wayne D. Woodson, Wenping Zhao
  • Patent number: 6830798
    Abstract: A friction disk suitable for running as an assembly of interleaved disks in a transmission is disclosed. A rigid metallic core on backing plate is covered on one or both sides with a wafer of non-woven yarn wherein the yarn comprises a continuous wound length of heat resistant yarn in a non-overlapping fashion. The yarn is bonded to the core by a thermosetting resin, which is impregnated into the yarn by less than 80% by weight to preserve porosity and allowing penetration of the cooling transmission fluid. The yarn preferably is composed of carbon fibers or filaments.
    Type: Grant
    Filed: July 10, 2002
    Date of Patent: December 14, 2004
    Assignee: Raytech Composites, Inc.
    Inventors: Laurie S. Bowles, Samuel A. Truncone, James J. Petroski
  • Publication number: 20040229029
    Abstract: A wet friction material is disclosed bonded to a plate for transmission of motion, with the friction material made up of a porous fiber substrate, which is at least partially impregnated with a catalyzed resorcinol diglycidyl ether resin to improve friction properties.
    Type: Application
    Filed: January 12, 2004
    Publication date: November 18, 2004
    Applicant: Raytech Composites, Inc.
    Inventors: Laurie Bowles, Samuel Truncone, Wayne D. Woodson, Wenping Zhao
  • Patent number: 6484853
    Abstract: A single sided friction assembly is provided in which an annular ring of friction material is provided on only one side of a relatively heat conductive metallic core plate, with the rings facing the same direction, and the ring of friction material engaging the rear bare metal side of an adjacent disk. An actuator is provided to bring the assembly into frictional engagement. Modifications are made at one and preferably both ends of the assembly to accommodate thermal deformations of the disks.
    Type: Grant
    Filed: August 15, 2001
    Date of Patent: November 26, 2002
    Assignee: Raytech Composites, Inc.
    Inventor: Przemyslaw A. Zagrodzki